Epoxy Resin Composition Warpage Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization of semiconductor packages leads to warpage issues due to differences in thermal expansion and curing shrinkage, affecting soldering and reliability, while increasing glass transition temperature to improve warpage resistance increases moisture absorption, and high inorganic filler content reduces flowability.
Innovation Solution
An epoxy resin composition comprising an epoxy resin, a polyorganosiloxane resin, a curing agent, and an inorganic filler, with specific weight percentages and formulations to enhance adhesion, crack resistance, and flowability, including a polyorganosiloxane resin for improved interface adhesion and a curing accelerator for efficient curing, while maintaining low curing shrinkage and high glass transition temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass transition temperature is increased to improve warpage resistance, then warpage resistance is improved, but moisture absorption increases
Solution Approach 1:
The patent uses a composite resin system combining epoxy resin with polyorganosiloxane resin to achieve both high glass transition temperature (improved warpage resistance) and low moisture absorption. The polyorganosiloxane component contributes to thermal stability while the specific molecular structure maintains low hygroscopicity, resolving the contradiction between thermal performance and moisture resistance.
Solution Approach 2:
The patent optimizes the glass transition temperature parameter to a specific range (100°C to 150°C) rather than maximizing it, and controls moisture absorption content within 0.5-2.0%. This parameter optimization approach achieves sufficient warpage resistance while preventing excessive moisture absorption that would occur with higher Tg materials.
2Stability of the object's composition
If inorganic filler content is increased to improve warpage resistance, then warpage resistance is improved, but flowability deteriorates
Solution Approach 1:
The patent uses a mixed filler system with different particle sizes and types (silica, alumina, titania) to create local variations in filler distribution and properties. This allows optimization of flow characteristics in the melt state while maintaining high overall filler content (70-85 wt%) for warpage resistance. The diverse filler composition enables both good flowability and dimensional stability.
Solution Approach 2:
The patent controls the total inorganic filler content within a specific range (70-85 wt%) and uses surface-treated fillers to maintain adequate flowability. The filler particle size distribution and surface treatment parameters are optimized to balance flow characteristics during molding with warpage resistance in the cured state.
3Strength
If polyorganosiloxane resin is added to improve interface adhesion, then interface adhesion is improved, but curing shrinkage increases
Solution Approach 1:
The patent controls the polyorganosiloxane resin content within a specific range (0.1-5.0 wt%) to achieve adequate interface adhesion while limiting curing shrinkage. The molecular weight and structure of the polyorganosiloxane are also controlled to minimize shrinkage contribution while maintaining adhesion benefits.
Solution Approach 2:
The patent combines polyorganosiloxane resin with epoxy resin in a composite system where the epoxy provides structural integrity and low shrinkage, while the polyorganosiloxane provides interface adhesion. This composite approach balances the competing requirements of adhesion and shrinkage control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent adhesion to silicon-based die adhesives, high crack resistance, and reliable encapsulation with improved warpage resistance and flowability, ensuring reliable semiconductor packages without halogen flame retardants.
Implementation Method 1
excellent adhesion to silicon-based die adhesives
Implementation Method 2
an epoxy resin composition for encapsulating a semiconductor device, the composition including an epoxy resin; a polyorganosiloxane resin; a curing agent; a curing accelerator
Data Source
AI summary
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler: