Hydrogenated Alicyclic Epoxy Resin for Optical Waveguide Adhesion
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Solution Overview
Problem
Optical waveguides require excellent adhesive properties with substrates for reliable performance, but existing formulations, such as those using silane coupling agents in epoxy resin compositions, fail to adequately meet this requirement.
Innovation Solution
A hydrogenated alicyclic epoxy resin photosensitive composition is used, incorporating specific divalent groups and a photocationic polymerization initiator, which forms a core or clad with enhanced adhesive properties when applied to substrates and patterned through photo-processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silane coupling agent is added to an epoxy resin composition, then the adhesive properties are improved, but the requirement for excellent adhesive properties cannot be sufficiently satisfied
Solution Approach 1:
The patent changes the chemical parameters of the epoxy resin by introducing specific divalent groups (—SO2—, —C(CH3)2—, —C(CH3)H—, or —CH2—) at defined positions in the molecule structure. This structural parameter change enhances the inherent adhesive properties of the epoxy resin, eliminating the need for additional coupling agents while achieving reliable adhesive performance.
Solution Approach 2:
The patent creates a composite molecular structure within the epoxy resin by combining the base epoxy resin with specific divalent groups and aromatic rings having branched alkyl substituents. This internal composite structure provides both the adhesive functionality and the structural integrity needed for reliable performance, replacing the conventional approach of adding separate coupling agents.
2Device complexity
If conventional epoxy resin composition is used, then the formulation is simple, but the adhesive properties with substrate are insufficient
Solution Approach 1:
The patent modifies the molecular parameters of the epoxy resin by incorporating specific divalent groups and aromatic structures with branched alkyl substituents. This parameter change enhances adhesive properties while maintaining formulation simplicity, as the enhanced resin serves as a single-component solution rather than requiring multiple additives.
3Manufacturing precision
If photo-processing is applied to form patterns, then the optical waveguide structure is formed, but the adhesive properties must be maintained during and after processing
Solution Approach 1:
The patent ensures that the photo-processing parameters (exposure conditions, development parameters) are optimized to work with the modified epoxy resin structure. The specific molecular structure with divalent groups and aromatic rings maintains adhesive properties throughout the photo-processing sequence, allowing precise pattern formation without compromising bond strength.
Solution Approach 2:
The patent incorporates the adhesive-enhancing molecular structure into the epoxy resin before photo-processing begins. This preliminary structural preparation ensures that the resin maintains excellent adhesive properties during the subsequent photo-processing steps, enabling precise pattern formation while preserving bond strength to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting optical waveguide exhibits superior adhesive properties with the substrate, leading to improved reliability and performance, particularly in opto-electric hybrid boards.
Implementation Method 1
a photocationic polymerization initiator
Data Source
AI summary
To provide an optical waveguide having excellent adhesive properties with respect to a substrate, an epoxy resin photosensitive composition for an optical waveguide and a photosensitive film for an optical waveguide for fabricating the optical waveguide, and an opto-electric hybrid board including the optical waveguide.