Epoxy-Modified Resist Composition for Adhesion and Pattern Collapse
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Solution Overview
Problem
Current resist materials face challenges in achieving excellent adhesion to substrates and preventing pattern collapse during the formation of resist patterns, especially in applications involving thick films and miniaturized patterns, where existing methods increase process complexity and do not adequately improve adhesion or lithography properties.
Innovation Solution
A resist composition comprising a base component that changes solubility in an alkali developing solution under acid action, combined with an epoxy resin, which generates acid upon exposure to form a resist film with enhanced adhesion and reduce pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resist materials and methods are used, then the resist pattern formation process is simple, but adhesion to substrates is insufficient and pattern collapse occurs
Solution Approach 1:
The patent combines the base resin and epoxy resin into a single resist composition formulation, merging the adhesion function (epoxy) with the lithography function (base resin) into one integrated material system, eliminating the need for separate adhesion treatment steps
Solution Approach 2:
The epoxy resin serves multiple functions simultaneously: it provides adhesion to the substrate, prevents pattern collapse, and maintains lithography performance, making the resist composition universally applicable for thick film and miniaturized pattern applications without requiring additional process steps
2Volume of moving object
If thick films are used, then the resist film has sufficient coverage, but pattern collapse occurs
Solution Approach 1:
The patent creates a composite resist material system combining base resin and epoxy resin, where the epoxy component provides structural support and adhesion that prevents pattern collapse in thick film applications while maintaining the necessary film coverage
3Manufacturing precision
If miniaturized patterns are formed, then the resolution is improved, but pattern collapse increases
Solution Approach 1:
The epoxy resin provides localized adhesion and structural support at the pattern interfaces and critical regions, strengthening where needed to prevent collapse of miniaturized features while maintaining the high resolution achieved through lithography
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves excellent adhesion to substrates and suppresses pattern collapse, improving the overall lithography performance and simplifying the resist pattern formation process.
Implementation Method 1
an acid generator component (B) that generates acid upon exposure
Implementation Method 2
a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid
Implementation Method 3
an epoxy resin (G)... achieves excellent adhesion to substrates
Data Source
AI summary
A resist composition that includes a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, an acid generator component (B) that generates acid upon exposure, and an epoxy resin (G). Also, a method of forming a resist pattern that includes using the above resist composition to form a resist film on the substrate, conducting exposure of the resist film, and alkali-developing the resist film to form a resist pattern.