Epoxy Sealing Composition for Moisture-Resistant Semiconductor Packaging
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Solution Overview
Problem
Semiconductor devices using copper wire and epoxy resin-based sealing compositions face challenges with moisture resistance reliability under bias voltage and require improved thermal conductivity, as existing solutions with hydrotalcite compounds and epoxy resin anisotropic structures do not adequately address these issues.
Innovation Solution
A sealing composition comprising an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound with a Mg/Al ratio of 2.4 or more, or a hydrotalcite compound represented by Formula (1), along with a magnesium-containing compound, which provides enhanced ion trapping and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used as sealing composition, then sealing performance is achieved, but moisture resistance reliability deteriorates under bias voltage
Solution Approach 1:
A coupling agent is introduced as an intermediary substance between the epoxy resin and copper wire. The coupling agent has dual functionality: it bonds with both the epoxy resin and copper wire, while simultaneously preventing chlorine ions from the epoxy resin from corroding the copper wire. This mediator resolves the contradiction by allowing the epoxy resin to maintain its sealing function while blocking its harmful corrosive effect on the copper wire.
2Temperature
If conventional sealing composition is used, then manufacturing simplicity is maintained, but thermal conductivity is insufficient
Solution Approach 1:
The sealing composition is formulated as a composite material system comprising epoxy resin, curing agent, coupling agent, and inorganic filler. Each component contributes specific properties: the epoxy resin provides sealing, the coupling agent enables thermal conduction and corrosion protection, and the inorganic filler enhances thermal conductivity. This composite approach achieves high thermal conductivity while maintaining reasonable manufacturing complexity through a systematic multi-component formulation.
3Quantity of substance
If copper wire is used instead of gold, then cost is reduced, but corrosion resistance deteriorates
Solution Approach 1:
The coupling agent serves as a protective intermediary layer between the copper wire and the epoxy resin containing chlorine ions. This intermediary prevents direct contact between the corrosive chlorine ions and the copper wire, thereby protecting the copper wire from corrosion while allowing the cost-effective copper material to be used instead of expensive gold.
Solution Approach 2:
The chlorine ions, which are inherently harmful and corrosive to copper wire, are converted into a beneficial protective mechanism. The coupling agent selectively binds with these chlorine ions, transforming them from harmful corrosive agents into part of a protective complex that prevents copper corrosion while maintaining the sealing composition's functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly improves moisture resistance reliability and thermal conductivity of semiconductor devices, effectively addressing the limitations of previous technologies by maintaining ion trapping effects and achieving high thermal conductivity.
Implementation Method 1
attempts have been made to allow a sealing composition to include a hydrotalcite compound as an ion trapping agent for trapping impurity ions
Implementation Method 2
there is a demand to increase thermal conductivity of a sealing material for a semiconductor package instead of attaching a heat spreader
Data Source
AI summary
A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg1-xAlx(OH)2(CO3)x/2·mH2O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.