Epoxy-Filled Sensor Housing for Bubble-Free Thermal Response
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Solution Overview
Problem
Existing sensors face challenges in providing reliable and reproducible measurements due to voids, vesicles, and bubbles formed by solvents in common filling materials, leading to inhomogeneous surroundings and variable response times.
Innovation Solution
The use of epoxy resin as a filling and fixing material in the sensor housing eliminates voids and bubbles, ensuring a homogeneous environment that enhances measurement reliability and response time consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If common filling materials (alumina oxide, silicon oxide) with solvents are used, then the housing can be filled and sensor element fixed, but voids, vesicles and bubbles occur leading to inhomogeneous surrounding and unreliable measurements
Solution Approach 1:
The patent changes the fundamental parameter of the filling material from solvent-based (alumina oxide, silicon oxide) to solvent-free epoxy resin. This parameter change eliminates the formation of voids, vesicles and bubbles that occur with solvent-based materials, thereby achieving homogeneous surrounding of the sensor element and reliable measurements without sacrificing ease of manufacture
Solution Approach 2:
The patent employs epoxy resin as a composite filling material that combines the functions of filling, fixing, and providing homogeneous thermal environment. This composite material approach replaces traditional solvent-based filling materials and achieves both ease of manufacture and measurement reliability simultaneously
2Ease of manufacture
If common filling materials with solvents are used, then the housing can be filled and sensor element fixed, but inhomogeneities occur causing variations in response time
Solution Approach 1:
The patent changes the physical parameter of the filling material from solvent-based to solvent-free epoxy resin. This eliminates inhomogeneities that cause response time variations, ensuring consistent and reliable response time while maintaining ease of manufacture through the same filling process
3Measurement precision
If sensor element is arranged in the second portion of housing with smaller diameter, then measurement accuracy and response time improve, but handling stability and lead stabilization decrease
Solution Approach 1:
The patent segments the housing into two distinct portions: a first portion with larger diameter for handling and lead stabilization, and a second portion with smaller diameter for accurate measurement. This segmentation allows each portion to fulfill its specific function optimally without compromise
Solution Approach 2:
The patent applies local quality by giving different diameters to different portions of the housing. The first portion has larger diameter for handling stability, while the second portion has smaller diameter for measurement precision. Each local region is optimized for its specific function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of epoxy resin in sensor housings results in improved measurement reliability, reduced variability in response times, and increased sensitivity, enabling more accurate and consistent sensor readings.
Implementation Method 1
The homogenous epoxy resin causes a homogenous heat transfer from the environment to the sensor element resulting in a fast thermal response
Data Source
AI summary
A sensor including a sensor element and electrical leads, whereby the sensor element is connected to the electrical leads. Further, a housing is provided, whereby the housing has an opening, and the sensor element is arranged in the housing such that the electrical leads protrude from the opening. The housing is filled with epoxy resin and the epoxy resin fixes the sensor element and the electrical leads in the housing.