Epoxy Silane Resin for High-Temperature Wellbore Remediation
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Solution Overview
Problem
Epoxy resins used for wellbore remediation have low temperature stability, and their curing agents interfere with silicon resin-curing agents, making simultaneous use difficult and costly, while furan resins are brittle and lack adhesion to casing.
Innovation Solution
A curable composition comprising an epoxy silane monomer, a hardener, and a carrier fluid is used, which forms a homogeneous epoxy silane resin with improved temperature stability and adhesion, reducing segregation of domains and costs by including both epoxide and silane functionalities on a single monomer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If epoxy resins are used for wellbore remediation, then they flow easily into small cracks and microannuli, but they have low temperature stability and are thermally unstable at temperatures over about 400° F.
Solution Approach 1:
The patent combines epoxy and silane resins into a single composition that exhibits both the flowability of epoxy resins into microannuli and the temperature stability of silane resins at temperatures over 400° F., resolving the contradiction between ease of operation and temperature resistance
Solution Approach 2:
The invention uses a composite resin system comprising both epoxy and silane components that leverages the complementary properties of each material type to achieve simultaneous flowability into tight spaces and thermal stability at high temperatures
2Temperature
If silicon resins are used as an alternative to epoxy resins, then they provide temperature stability, but they have poor adhesion properties
Solution Approach 1:
The patent merges the temperature stability of silane resins with the adhesion properties of epoxy resins in a single composition, allowing the material to simultaneously provide thermal resistance and strong bonding to wellbore surfaces
3Adaptability or versatility
If epoxy resin-curing agents and silicon resin-curing agents are used simultaneously, then both resin types can be employed, but they interfere with each other making simultaneous use difficult and costly
Solution Approach 1:
The invention employs a universal curing system that can effectively cure both epoxy and silane resin components without interference, eliminating the need for separate curing agents and simplifying the remediation process while reducing costs
4Temperature
If furan resins are used, then they provide extreme temperature stability, but they are typically brittle and do not have desirable adhesion to casing
Solution Approach 1:
The patent creates a composite resin system that combines the thermal stability of furan-like resins with the adhesion and flexibility properties of epoxy and silane resins, achieving a balance between temperature resistance and mechanical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting epoxy silane resin exhibits higher temperature tolerance, deeper well servicing capability, and reduced costs due to homogeneous polymerization and single-component transportation, with enhanced mechanical and adhesion properties.
Implementation Method 1
A curable composition comprising an epoxy silane monomer, a hardener, and a carrier fluid is used, which forms a homogeneous epoxy silane resin
Data Source
AI summary
Various embodiments disclosed relate to a curable composition and resin for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing in a subterranean formation a curable composition. The curable composition can include an epoxy silane monomer, a hardener, and carrier fluid. The curable composition can include an epoxy monomer, an amine silane hardener, and carrier fluid. The method can also include curing the curable composition to form an epoxy silane resin.