Epoxy Silicone Light-Resistant Sealing for LED Lenses
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Solution Overview
Problem
Conventional epoxy resin compositions used in light-emitting devices lack sufficient light resistance, crack resistance, and adhesiveness, particularly during hot and cold cycles, which can lead to decreased brightness and material failure.
Innovation Solution
The development of an epoxy silicone with a specific monocyclic and bicyclo siloxane skeleton structure, comprising specific organic groups and a controlled ratio of structural units, which enhances transparency, heat resistance, and adhesiveness, and is suitable for injection molding and lens applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If epoxy resin composition is used for light-emitting device sealing, then heat resistance is improved, but light resistance and crack resistance deteriorate
Solution Approach 1:
The patent uses a composite material system combining epoxy resin with specific siloxane compounds (cyclic siloxane and bicyclo siloxane) to achieve both heat resistance from the epoxy matrix and improved light resistance and crack resistance from the siloxane components. This composite approach allows simultaneous satisfaction of multiple performance requirements that cannot be met by epoxy resin alone.
Solution Approach 2:
The patent modifies the chemical composition parameters by incorporating specific ratios of cyclic siloxane (0.1-10 mol%) and bicyclo siloxane (0.1-10 mol%) into the epoxy resin system. By controlling these compositional parameters, the material achieves enhanced light resistance and crack resistance while maintaining the heat resistance provided by the epoxy base.
2Temperature
If conventional epoxy silicone with T structure is used, then transparency and heat resistance are improved, but crack resistance deteriorates
Solution Approach 1:
The patent combines epoxy silicone with T structure (providing heat resistance and transparency) with bicyclo siloxane compounds (providing crack resistance). This composite material system allows the final product to simultaneously exhibit heat resistance from the epoxy silicone component and crack resistance from the bicyclo siloxane component, resolving the contradiction between these two properties.
3Reliability
If sealing material is required to maintain performance during hot and cold cycles, then adhesiveness and crack resistance are improved, but material complexity increases
Solution Approach 1:
The patent optimizes the compositional parameters by limiting the content of cyclic siloxane to 0.1-10 mol% and bicyclo siloxane to 0.1-10 mol%, ensuring that the material achieves the required adhesiveness and crack resistance for hot/cold cycle performance while keeping the overall composition relatively simple and manageable for industrial application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy silicone composition provides excellent light resistance, heat resistance, and adhesiveness, preventing cracks and maintaining brightness over time, while being suitable for use in light-emitting devices and lenses.
Implementation Method 1
Epoxy silicone having a siloxane skeleton as a repeat unit and an epoxy group as an organic group has an excellent transparency and heat resistance
Implementation Method 2
epoxy silicone having a siloxane skeleton as a repeat unit and an epoxy group as an organic group has an excellent transparency and heat resistance, which is provided by an epoxy resin, and additionally, light resistance and oxidation resistance
Data Source
AI summary
An epoxy silicon, which comprises at least a compound represented by the following general formula (1), and a compound represented by the following general formula (2); and which is represented by an average composition formula (3), wherein a value of [g/(a+b+c+d+e+f+g+h+i+j)] falls within a range of 0.020 or less. (R12YSiO1/2)a(R33SiO1/2)b(R32SiO2/2)c (R3YSiO2/2)d(R1ZSiO2/2)o(R1R2S iO2/2)f (R1HSiO2/2)g(R3SiO3/2)h(YSiO3/2)i(SiO4/2) (3)