Epoxy-Modified Silicone Fine Particles for Non-Aggregating Resin Adhesion
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Solution Overview
Problem
Existing epoxy resins used for encapsulating electronic devices suffer from aggregation, poor dispersibility, and inadequate adhesion due to the use of additives like acrylic rubber, epoxy-modified silicone oil, and silicone rubber powders, which lack chemical bonding with epoxy resins, leading to insufficient stress relaxation and mechanical properties.
Innovation Solution
Epoxy-modified silicone fine particles with a core-shell structure, composed of spherical silicone rubber particles coated with polyorganosilsesquioxane, providing chemical bonding and preventing aggregation, ensuring excellent adhesion and dispersibility in thermosetting resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silicone rubber powder is added to epoxy resin to provide stress relaxation, then softness is improved, but dispersibility deteriorates due to poor compatibility
Solution Approach 1:
The invention changes the surface parameters of silicone rubber particles by coating them with polyorganosilsesquioxane, transforming the incompatible surface into a compatible one with epoxy resin. This parameter change enables the silicone rubber to disperse uniformly while maintaining its stress relaxation function.
Solution Approach 2:
The invention creates a composite structure where silicone rubber core is combined with polyorganosilsesquioxane shell, forming a hybrid material that exhibits both the stress relaxation properties of silicone rubber and the compatibility of polyorganosilsesquioxane with epoxy resin.
2Strength
If acrylic rubber is added to epoxy resin to improve stress relaxation, then softness is improved, but adhesion deteriorates due to lack of chemical reaction points
Solution Approach 1:
The invention introduces chemical functional groups (epoxy groups, amino groups, or isocyanate groups) onto the polyorganosilsesquioxane coating surface, changing the chemical parameters to enable reaction with epoxy resin and create strong adhesion while maintaining stress relaxation capability.
3Ease of operation
If epoxy-modified low-molecular-weight silicone is added to improve fluidity, then fluidity is improved, but compatibility deteriorates leading to aggregation
Solution Approach 1:
The invention uses a thin film of polyorganosilsesquioxane coating on silicone rubber particles, which provides flexibility and compatibility with epoxy resin, preventing aggregation while allowing the particles to disperse uniformly and maintain fluidity.
4Device complexity
If shell portion of acrylic resin or silicone is used without chemical bond, then simplicity is maintained, but adhesion deteriorates
Solution Approach 1:
The invention changes the chemical parameters of the shell portion by introducing reactive functional groups (epoxy, amino, or isocyanate groups) that can chemically bond with epoxy resin, thereby achieving strong adhesion without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy-modified silicone fine particles exhibit softness from silicone rubber, prevent aggregation, and enhance adhesion with thermosetting resins, resulting in improved mechanical properties such as bending strength and modulus of elasticity in cured products.
Implementation Method 1
epoxy-modified silicone fine particle having a core-shell structure which is obtained by coating spherical silicone rubber fine particle with a polyorganosilsesquioxane having an epoxy group-containing organic group
Implementation Method 2
silicone fine particles which do not aggregate in a thermosetting resin and do have softness derived from silicone rubber and excellent adhesion to the thermosetting resin
Data Source
AI summary
One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin while having softness derived from silicone rubber and have excellent adhesion with the thermosetting resin. The other purpose is to provide a method for preparing the same. The other purpose is to provide a thermosetting resin composition and an encapsulating material, each comprising the fine particles. The present invention provides an epoxy-modified silicone fine particle composed of (A) a spherical silicone rubber fine particle coated with (B) polyorganosilsesquioxane, wherein the spherical silicone rubber fine particle (A) has an average particle diameter of 0.1 to 100 μm and the polyorganosilsesquioxane (B) has an epoxy group-containing organic group.