Epoxy Resin Tape Preform Assembly for Clean Composite Bonding
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Solution Overview
Problem
Existing methods for assembling composite components, such as fibre-reinforced resin components, are inefficient and costly due to mechanical connections or uncontrolled application of spray-on adhesives, leading to resin contamination and process inefficiencies.
Innovation Solution
A double-sided tape with a backing layer and an epoxy resin layer, where the backing layer can be easily removed, allowing precise application of the resin layer to join reinforcement materials, which is compatible with the resin transfer process and avoids contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If mechanical connection (sewing or stapling) is used to attach pieces, then the pieces can be securely connected, but the process becomes time consuming and increases fabrication cost
Solution Approach 1:
The patent replaces mechanical connection methods (sewing, stapling) with a chemical bonding system using spray-on adhesive. The adhesive is applied in a controlled manner and then cured to create strong bonds between preformed pieces, eliminating the need for mechanical fasteners and significantly reducing assembly time.
Solution Approach 2:
The patent changes the bonding mechanism from mechanical to chemical by introducing an adhesive system. The adhesive application parameters (spray pattern, curing conditions) are optimized to achieve both strong bonds and rapid assembly, resolving the contradiction between connection strength and assembly speed.
2Ease of manufacture
If spray-on adhesive is applied to pieces, then attachment can be achieved, but the adhesive application is uncontrolled leading to contamination of the resin in subsequent moulding
Solution Approach 1:
The patent applies adhesive only to specific local areas of the preformed pieces where bonding is required, rather than coating entire surfaces. This controlled local application prevents excess adhesive from contaminating the resin during subsequent moulding operations while still achieving effective attachment.
Solution Approach 2:
The adhesive is applied and cured as a preliminary step before resin injection. This preliminary bonding action secures the pieces in position, allowing the resin to be injected without disturbing the assembly, thereby preventing contamination while maintaining attachment capability.
3Object-generated harmful factors
If controlled adhesive application is implemented, then resin contamination is reduced, but the complexity of the attachment process increases
Solution Approach 1:
The patent introduces a controlled adhesive application system as an intermediary between the preformed pieces and the resin injection process. This intermediary system manages the bonding function while preventing contamination, adding controlled complexity that resolves the contradiction between reducing harmful factors and maintaining process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape enables efficient, controlled adhesion of reinforcement materials, reducing waste and process time, while maintaining interlaminar shear strength and compatibility with resin transfer molding, resulting in high-quality composite components.
Implementation Method 1
an epoxy resin layer adhered to a first surface of the backing layer, the first surface providing a first level of adherence to the epoxy resin layer
Data Source
AI summary
A tape comprising: a backing layer; and an epoxy resin layer adhered to a first surface of the backing layer in a spiral pattern, the first surface providing a first level of adherence to the epoxy resin layer so that when the epoxy resin layer is applied to a surface the backing layer can be removed from the epoxy resin layer.