Epoxy Semiconductor Processing Tape for Low-Shrink Reflow Dicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional dicing tapes lack heat resistance and thermal stability in reflow steps, leading to peeling and dropping out from ring frames during high-temperature processing, complicating semiconductor manufacturing processes.
Innovation Solution
A semiconductor processing tape with a pressure-sensitive adhesive layer formed on a substrate film, using a cured product of an epoxy compound-containing composition, ensuring thermal shrinkage ratio of 5.0% or less at 260°C, fracture elongation of 15% or more, and tensile elastic modulus of 0.5 MPa or more, allowing it to function as both a support in reflow steps and a dicing tape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional dicing tapes are used in reflow steps, then the process complexity is reduced, but the tape peels and drops out from ring frames due to lack of heat resistance
Solution Approach 1:
The patent modifies the physical and chemical parameters of the substrate film by using a cured epoxy compound-containing composition. This changes the thermal properties of the tape, enabling it to maintain structural integrity and adhesive strength at high temperatures (260°C) during reflow steps, thus preventing peeling and dropping out while maintaining process simplification
Solution Approach 2:
The patent employs a composite structure consisting of a cured epoxy compound-containing composition as the substrate film combined with a pressure-sensitive adhesive layer. This composite material design provides both the heat resistance needed for reflow processing and the adhesive properties required for secure attachment to ring frames, resolving the contradiction between heat resistance and attachment stability
2Temperature
If the thermal shrinkage ratio is reduced to 5.0% or less at 260°C, then heat resistance is improved, but the flexibility and fracture elongation may be compromised
Solution Approach 1:
The patent optimizes the composition parameters of the epoxy compound-containing composition to achieve a thermal shrinkage ratio of 5.0% or less at 260°C. By carefully selecting and proportioning the epoxy compounds and curing agents, the substrate film achieves low thermal shrinkage while maintaining adequate fracture elongation of 15% or more, balancing heat resistance with compositional stability
Solution Approach 2:
The patent creates different local properties within the substrate film by using a multi-component epoxy system. The cured epoxy compound-containing composition exhibits low thermal shrinkage (5.0% or less) in the high-temperature environment, while maintaining sufficient fracture elongation (15% or more) at room temperature, achieving local optimization of thermal and mechanical properties
3Temperature
If a cured product of epoxy resin is used to improve heat resistance, then thermal stability is improved, but the tape may still experience high thermal shrinkage and peeling at 260°C
Solution Approach 1:
The patent modifies the chemical composition parameters of the epoxy system to achieve a thermal shrinkage ratio of 5.0% or less at 260°C. By selecting specific epoxy compounds and optimizing the curing agent ratio, the cured product achieves both thermal stability and low thermal shrinkage, preventing peeling from ring frames during reflow steps
Solution Approach 2:
The patent uses a composite material system where the cured epoxy compound-containing composition is combined with a pressure-sensitive adhesive layer. This composite structure provides both the thermal stability needed for high-temperature processing and the adhesive strength required to prevent peeling, overcoming the limitations of conventional epoxy-based tapes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape maintains attachment to ring frames under high heat, simplifies reflow and dicing steps, and facilitates smooth chip pickup with enhanced flexibility and stability, reducing process complexity.
Implementation Method 1
a pressure-sensitive adhesive layer is formed on a substrate film
Implementation Method 2
the substrate film is a cured product of an epoxy compound-containing composition
Data Source
AI summary
A semiconductor processing tape, in which a pressure-sensitive adhesive layer is formed on a substrate film, wherein the substrate film is a cured product of an epoxy compound-containing composition, and a thermal shrinkage ratio after retention under an atmosphere at 260° C. for 10 minutes, of the semiconductor processing tape, is 5.0% or less.