Epoxy Semiconductor Processing Tape for Reflow Heat Stability
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Solution Overview
Problem
Conventional dicing tapes lack heat resistance and thermal stability during reflow steps, leading to peeling and dropping out from ring frames at high temperatures, complicating semiconductor processing.
Innovation Solution
A semiconductor processing tape with a pressure-sensitive adhesive layer on a substrate film made from a cured epoxy compound composition, ensuring thermal shrinkage ratio of 5.0% or less at 260°C, fracture elongation of 15% or more at 23°C and 15% or more after 10 minutes at 260°C, and tensile elastic modulus of 0.5 MPa or more at 260°C, allowing it to function as both a support in reflow steps and a dicing tape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional dicing tapes are used in reflow steps, then the processing steps can be simplified, but the tape peels and drops out from ring frames due to high temperature
Solution Approach 1:
The patent changes the thermal parameters of the dicing tape by using a substrate film made from cured epoxy compound composition, which has a glass transition temperature of 80°C or higher. This parameter change enables the tape to maintain its mechanical properties and adherence at reflow temperatures of 260°C, preventing peeling and dropping out while allowing the tape to serve dual functions in reflow and dicing steps.
Solution Approach 2:
The patent employs a composite material structure consisting of a substrate film made from cured epoxy compound composition and a pressure-sensitive adhesive layer. This composite structure combines the high heat resistance of the epoxy substrate with the adhesive properties needed for securing semiconductor wafers, enabling the tape to function reliably in both high-temperature reflow steps and subsequent dicing operations.
2Reliability
If the thermal shrinkage ratio is reduced to prevent tape peeling, then heat resistance is improved, but flexibility may be compromised
Solution Approach 1:
The patent carefully controls the thermal shrinkage ratio of the substrate film to be 5.0% or less when heated at 260°C for 10 minutes, while simultaneously maintaining a fracture elongation of 15% or more at room temperature. This dual parameter control achieves both heat resistance (preventing peeling) and flexibility (enabling chip pickup) through optimized composition of the epoxy compound and curing conditions.
3Device complexity
If a single material is used for both support and dicing tape, then device complexity is reduced, but the material must satisfy conflicting requirements of heat resistance and adhesion
Solution Approach 1:
The patent creates a universal dicing tape that can perform multiple functions: serving as a support carrier during high-temperature reflow steps and as a dicing tape for securing and processing semiconductor wafers. The substrate film made from cured epoxy compound composition provides the high-temperature stability needed for reflow, while the pressure-sensitive adhesive layer maintains adhesion properties for wafer securing, enabling one material to satisfy conflicting requirements through functional layering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape maintains adherence to ring frames under high heat, simplifies reflow and dicing steps, and facilitates smooth chip pickup with enhanced flexibility and resistance to warping, enabling efficient semiconductor processing.
Implementation Method 1
the substrate film is a cured product of an epoxy compound-containing composition
Implementation Method 2
a crosslinking component composed of an epoxy compound
Implementation Method 3
a pressure-sensitive adhesive layer is formed on a substrate film
Data Source
AI summary
To provide a semiconductor processing tape, having excellent heat resistance even under the heating atmosphere of a reflow step. A semiconductor processing tape, in which a pressure-sensitive adhesive layer is formed on a substrate film, wherein the substrate film is a cured product of an epoxy compound-containing composition, and a thermal shrinkage ratio after retention under an atmosphere at 260°C for 10 minutes, of the semiconductor processing tape, is 5.0% or less.