Epoxy-Thiol Resin Composition for Room-Temperature Compression Sealing

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Solution Overview

Problem

Existing curable resin compositions require energy such as heating or ultraviolet irradiation for curing, which can affect the members, and the cured products may not withstand high compression or become unreusable due to insufficient flexibility or excessive flexibility.

Innovation Solution

A curable resin composition containing components (A) with two or more epoxy groups, (B) a thiol curing agent, (C) hollow resin particles, and (D) a curing accelerator, which can be cured at normal temperature, withstand high compression, and allow members to be reused.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If heating or ultraviolet irradiation is used for curing the curable resin composition, then the curing process can be initiated, but the members may be affected by heat or light

Engineering Contradiction:
Improvecuring processVSAvoidheat or light effect on members
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces thermal or photonic curing mechanisms with a chemical curing system using epoxy groups and thiol curing agents that react at normal temperatures, eliminating the need for external heat or light sources that could harm the members

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the curing conditions from requiring high temperature or UV irradiation to occurring at normal temperature through the use of specific chemical components (epoxy groups and thiol curing agents) that enable low-temperature curing

Inventive Principle:
Principle #35Parameter changes

2Strength

If the cured product is made more flexible to withstand high compression, then compression resistance improves, but the member may be transferred after curing due to insufficient surface curing

Engineering Contradiction:
Improvecompression resistanceVSAvoidmember reusability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent uses a composite curing system combining epoxy groups with thiol curing agents and hollow resin particles, creating a cured product that achieves both flexibility for compression resistance and sufficient surface curing for member retention

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the chemical composition and curing parameters to achieve the right balance between flexibility and surface curing strength, ensuring the cured product can withstand compression while maintaining member reusability

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves curing at normal temperature without heat or light, maintains high compression resistance, and ensures the reusability of members.

Implementation Method 1

a compound having two or more epoxy groups and a thiol curing agent

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Implementation Method 2

a curing accelerator

Methodology Applied
Scientific EffectCatalysis: Catalysis

Data Source

PatentEP4678695A1Curable resin composition
Publication Date: 2026.01.14 THREE BOND CO LTD
  • EP4678695A1 patent drawing
  • EP4678695A1 patent drawing
  • EP4678695A1 patent drawing

AI summary

The present invention provides a curable resin composition wherein the curable resin composition can be cured at normal temperature without use of any heat or light source, and a cured product thereof has excellent high compression resistance and sealability. The curable resin composition of the present invention contains the following components (A) to (D): component (A): a compound having two or more epoxy groups component (B): a thiol curing agent component (C): hollow resin particles component (D): a curing accelerator.