Epoxy-Thiol Resin Composition for Room-Temperature Compression Sealing
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Solution Overview
Problem
Existing curable resin compositions require energy such as heating or ultraviolet irradiation for curing, which can affect the members, and the cured products may not withstand high compression or become unreusable due to insufficient flexibility or excessive flexibility.
Innovation Solution
A curable resin composition containing components (A) with two or more epoxy groups, (B) a thiol curing agent, (C) hollow resin particles, and (D) a curing accelerator, which can be cured at normal temperature, withstand high compression, and allow members to be reused.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heating or ultraviolet irradiation is used for curing the curable resin composition, then the curing process can be initiated, but the members may be affected by heat or light
Solution Approach 1:
The patent replaces thermal or photonic curing mechanisms with a chemical curing system using epoxy groups and thiol curing agents that react at normal temperatures, eliminating the need for external heat or light sources that could harm the members
Solution Approach 2:
The patent changes the curing conditions from requiring high temperature or UV irradiation to occurring at normal temperature through the use of specific chemical components (epoxy groups and thiol curing agents) that enable low-temperature curing
2Strength
If the cured product is made more flexible to withstand high compression, then compression resistance improves, but the member may be transferred after curing due to insufficient surface curing
Solution Approach 1:
The patent uses a composite curing system combining epoxy groups with thiol curing agents and hollow resin particles, creating a cured product that achieves both flexibility for compression resistance and sufficient surface curing for member retention
Solution Approach 2:
The patent optimizes the chemical composition and curing parameters to achieve the right balance between flexibility and surface curing strength, ensuring the cured product can withstand compression while maintaining member reusability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves curing at normal temperature without heat or light, maintains high compression resistance, and ensures the reusability of members.
Implementation Method 1
a compound having two or more epoxy groups and a thiol curing agent
Implementation Method 2
a curing accelerator
Data Source
AI summary
The present invention provides a curable resin composition wherein the curable resin composition can be cured at normal temperature without use of any heat or light source, and a cured product thereof has excellent high compression resistance and sealability. The curable resin composition of the present invention contains the following components (A) to (D): component (A): a compound having two or more epoxy groups component (B): a thiol curing agent component (C): hollow resin particles component (D): a curing accelerator.


