Epoxy-Thiol Resin Composition for Image Sensor Adhesion
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Solution Overview
Problem
Conventional thiol-based resin compositions used in image sensor modules suffer from inferior moisture resistance and reduced adhesive strength after curing, particularly when exposed to moisture, due to the presence of ester structures in their molecular skeletons, which limits their applicability in high-temperature manufacturing processes and long-term reliability.
Innovation Solution
A resin composition combining epoxy resin with a specific thiol compound and a latent curing accelerator, specifically a thiol compound without ester bonds, such as a thiol-substituted glycoluril derivative, is used to achieve fast low-temperature curing, high adhesive strength, and extended pot life, while suppressing the decrease in adhesive strength after moisture resistance testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional thiol-based curing agents (containing ester structures) are used, then low temperature fast curability is achieved, but moisture resistance and adhesive strength after curing deteriorate
Solution Approach 1:
The invention changes the chemical structure parameter of the thiol-based curing agent by replacing ester structures with ether structures. This structural parameter change maintains the low temperature fast curability while eliminating the hydrolysis susceptibility of ester groups, thereby improving moisture resistance and adhesive strength retention after curing.
Solution Approach 2:
The invention uses a composite curing system combining the novel ether-based thiol compound with epoxy resin and latent curing accelerator. This composite material approach achieves synergistic effects where the ether-based thiol provides moisture resistance and the epoxy resin provides adhesive strength, while the latent curing accelerator enables low temperature fast curing.
2Temperature
If conventional thiol-based curing agents are used, then low temperature curability is achieved, but adhesive strength (peel strength) after curing decreases
Solution Approach 1:
The invention changes the chemical structure parameter of the thiol-based curing agent by replacing ester structures with ether structures. This structural parameter change maintains the low temperature fast curability while eliminating the hydrolysis susceptibility of ester groups, thereby improving moisture resistance and adhesive strength retention after curing.
3Temperature
If conventional thiol-based curing agents are used, then low temperature curability is achieved, but pot life becomes short
Solution Approach 1:
The invention introduces a latent curing accelerator as an intermediary substance that mediates the curing reaction between epoxy resin and thiol compound. This intermediary enables the curing reaction to proceed at low temperatures while controlling the reaction rate to maintain adequate pot life for processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables fast low-temperature curing with high peel strength and extended pot life, maintaining adhesive integrity even after moisture resistance testing, making it suitable for bonding diverse materials like engineering plastics, ceramics, and metals in image sensor modules.
Implementation Method 1
an epoxy resin in combination with a specific thiol compound... by using the epoxy resin in combination with a specific thiol compound and using a latent curing accelerator
Implementation Method 2
using a latent curing accelerator... by using the epoxy resin in combination with a specific thiol compound and using a latent curing accelerator
Data Source
AI summary
Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein R1, R2, R3 and R4 are each independently hydrogen or CnH2nSH (wherein n is 2 to 6), at least one of R1, R2, R3 and R4 is CnH2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.