Epoxy Composition UV Curing Adhesion Strength
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Solution Overview
Problem
Traditional epoxy-based adhesives have a slow curing time, which limits their application, and incorporating acrylate compounds to speed up curing compromises humidity reliability and low shrinkage properties.
Innovation Solution
An epoxy-based composition comprising epoxidized unsaturated polyolefin, thiol compounds, and a curing catalyst, which enables fast curing under UV light and enhances adhesion strength after thermal treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional epoxy based adhesive is used, then excellent adhesion strength and chemical stability are achieved, but curing time is slow
Solution Approach 1:
The patent uses a composite curing system combining thiol compounds and epoxidized unsaturated polyolefins with epoxy resin. This composite material approach enables dual-curing capability: UV light initiates rapid thiol-epoxide crosslinking for fast initial cure, while thermal energy completes the epoxy polymerization for final strength development, resolving the contradiction between fast curing and strong adhesion
Solution Approach 2:
The patent changes the chemical parameters of the curing system by introducing thiol compounds with specific functional groups and epoxidized unsaturated polyolefins with controlled epoxy content. This parameter modification allows the system to respond to different energy inputs (UV and heat), achieving both rapid initial cure and complete polymerization for optimal adhesion strength
2Loss of time
If acrylate compounds are incorporated to speed up curing, then curing time is reduced, but humidity reliability and low shrinkage property are damaged
Solution Approach 1:
The patent extracts and removes acrylate compounds from the adhesive formulation, replacing them with thiol compounds and epoxidized unsaturated polyolefins. This extraction eliminates the harmful effects of acrylates on humidity reliability and shrinkage properties while achieving fast curing through the thiol-epoxide reaction mechanism
Solution Approach 2:
The patent introduces thiol compounds as intermediary substances that mediate between UV light energy and the epoxy resin. The thiol groups absorb UV energy and transfer it to initiate rapid crosslinking, serving as a bridge that enables fast curing without requiring acrylate compounds, thus preserving humidity reliability and low shrinkage characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves rapid UV curing and significantly improves adhesion strength after thermal curing, maintaining humidity reliability and low shrinkage properties without using acrylates.
Implementation Method 1
The epoxy based composition exhibits fast curing property under UV light
Implementation Method 2
at least one curing catalyst
Implementation Method 3
improved adhesion strength after being further heated
Data Source
AI summary
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being further heated.