EPROM Cell Modified Floating Gate Structure
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Solution Overview
Problem
Inkjet printing technologies, such as thermal inkjet (TIJ) devices, face challenges in reducing the size of EPROM cells to increase packing density and prevent unauthorized cloning, while maintaining performance and security.
Innovation Solution
The use of a floating-gate transistor with a modified gate structure and a reduced surface area for the first metal layer, combined with short-channeled gate designs for select transistors, allows for smaller EPROM cell size, increased packing density, and enhanced program ratio, while functional and process tuning compensates for reduced coupling and program ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the surface area of the first metal layer is reduced, then the EPROM cell size is reduced and packing density is increased, but the coupling ratio and program ratio are reduced
Solution Approach 1:
The patent applies local quality by creating an asymmetric gate structure where the first metal layer has a reduced surface area compared to conventional designs. This localized modification in the gate region allows smaller cell size while the rest of the transistor structure maintains normal dimensions to preserve electrical performance. The selective reduction of metal layer area in specific locations achieves area reduction without proportionally reducing coupling ratio.
Solution Approach 2:
The patent changes physical parameters by reducing the surface area parameter of the first metal layer while adjusting other parameters such as the channel length and gate oxide thickness to compensate. By modifying the channel length to be shorter and adjusting the gate structure dimensions, the patent achieves a new parameter balance that reduces cell area while maintaining acceptable coupling ratio through optimized parameter combinations rather than uniform scaling.
2Area of moving object
If the surface area of the first metal layer is reduced, then the EPROM cell size is reduced and packing density is increased, but the program ratio is reduced
Solution Approach 1:
The patent applies local quality by creating an asymmetric gate structure where the first metal layer has a reduced surface area compared to conventional designs. This localized modification in the gate region allows smaller cell size while the rest of the transistor structure maintains normal dimensions to preserve electrical performance. The selective reduction of metal layer area in specific locations achieves area reduction without proportionally reducing coupling ratio.
Solution Approach 2:
The patent changes physical parameters by reducing the surface area parameter of the first metal layer while adjusting other parameters such as the channel length and gate oxide thickness to compensate. By modifying the channel length to be shorter and adjusting the gate structure dimensions, the patent achieves a new parameter balance that reduces cell area while maintaining acceptable coupling ratio through optimized parameter combinations rather than uniform scaling.
3Area of moving object
If short-channeled gate designs are used for select transistors, then EPROM cell size is reduced and packing density is increased, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the transistor gate into distinct segments - the first metal layer with reduced surface area and the polysilicon layer. This segmentation allows independent optimization of each layer's dimensions and properties. The short-channeled gate is implemented as a separate structural element with defined boundaries, allowing precise control over channel length while maintaining manufacturing feasibility through clear fabrication process steps for creating segmented structures.
Data Source
AI summary
An electronically programmable read-only memory (EPROM) cell includes a semiconductor substrate having source and drain regions; a floating gate, adjacent to the source and drain regions and separated from the semiconductor substrate by a first dielectric layer, the floating gate including: a polysilicon layer formed over the first dielectric layer; a first metal layer electrically connected to the polysilicon layer, where the surface area of the first metal layer is less than 1000 μm2; and a control gate comprising a second metal layer, capacitively coupled to the first metal layer through a second dielectric material disposed therebetween.


