Power Wiring Module Layout for Compact EPS Control Boards

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Electric driving devices face challenges in reducing the area of power supply wiring on circuit boards and enhancing the reliability of control circuits, particularly due to increased heat generation and the need for efficient heat dissipation.

Innovation Solution

The configuration includes a power supply wiring module molded with resin, incorporating a choke coil, capacitor, and wiring to supply power to circuit boards, with a heat sink sandwiched between the wiring module and the control circuit board to reduce the area of power supply wiring and enhance heat dissipation, thereby reducing the size of the electronic control unit and improving reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If power supply wiring area is reduced on the circuit board, then the board area is reduced, but the power supply capability is worsened

Engineering Contradiction:
Improvecircuit board areaVSAvoidpower supply capability
Core Design Contradiction:
Area of stationary objectVSPower

Solution Approach 1:

The power supply wiring is moved from the two-dimensional circuit board plane to a three-dimensional modular structure. The power supply wiring module contains thick-wire wiring and power components in a stacked configuration, enabling high power supply capability while maintaining a compact footprint that reduces the circuit board area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The power supply system is segmented into a dedicated power supply wiring module that contains all power-related components (wiring, choke coil, capacitor) in a separate unit from the control circuit board. This segmentation allows the main circuit board to be reduced in area while the power module handles the high power supply requirements independently.

Inventive Principle:
Principle #1Segmentation

2Length of stationary object

If field-effect transistors are mounted on the power circuit board to reduce power module height, then the power module height is reduced, but the heat generation affects the control circuit reliability

Engineering Contradiction:
Improvepower module heightVSAvoidcontrol circuit reliability
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The system is divided into separate power module and control circuit board, with thermal isolation between them. The power module contains heat-generating components (field-effect transistors, choke coil, capacitor) while the control circuit board houses sensitive control electronics. This spatial segmentation prevents heat from affecting control circuit reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat sink is introduced as an intermediary component between the power module and control circuit board. The heat sink absorbs and dissipates heat from power components, preventing thermal transfer to the control circuit board and maintaining control circuit reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If heat dissipation is improved for the control circuit, then the reliability is improved, but the device complexity increases

Engineering Contradiction:
Improvecontrol circuit reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat sink serves multiple functions: it dissipates heat from power components in the power module, prevents thermal transfer to the control circuit board, and provides structural support for mounting components. This multi-functionality improves control circuit reliability without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the area of power supply wiring, suppresses heat generation in control circuits, and extends the life of the circuit board, leading to a more reliable electric driving device with improved heat dissipation and reduced size.

Implementation Method 1

a first heat sink sandwiched between the power supply wiring module and the second circuit board... heat generation in the control circuit is suppressed

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12142972B2Electric driving device and electric power steering device
Publication Date: 2024.11.12 NSK LTD
  • US12142972B2 patent drawing
  • US12142972B2 patent drawing
  • US12142972B2 patent drawing

AI summary

To provide an electric driving device and an electric power steering device with a smaller area of power supply wiring in a circuit board and higher reliability of the circuit board. An electric driving device includes a motor and an electronic control unit that controls rotation of the motor. The electronic control unit includes a first circuit board, a second circuit board, a power supply wiring module, and a heat sink. The first circuit board is provided with a transistor that outputs an electric current to excite a motor coil. The second circuit board includes a control circuit that controls an electric current supplied to the transistor. The power supply wiring module is configured by molding, with resin, a choke coil for noise removal, a capacitor, and wiring that supplies electric power to at least one of the first circuit board and the second circuit board. The heat sink is sandwiched between the power supply wiring module and the second circuit board.