Electrostatic Chuck Lamp Array for Wafer Temperature Uniformity
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Solution Overview
Problem
Existing electrostatic chuck (ESC) cooling systems fail to adequately control non-radial temperature uniformity in wafers, leading to increased temperature variations and inadequate accuracy in temperature control as wafer sizes increase.
Innovation Solution
An electrostatic chuck with a lamp array embedded in an insulating layer, where each lamp can be independently controlled for on/off function and output power, combined with a fluid cooling system, to achieve precise temperature control across the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ring type multi-zone cooling system is used, then radial temperature non-uniformity can be adjusted, but non-radial temperature non-uniformity cannot be controlled and temperature control accuracy is insufficient
Solution Approach 1:
The cooling system is divided into multiple independent cooling zones (first cooling zone, second cooling zone, third cooling zone) with separate temperature control. Each zone can be independently adjusted to control temperature distribution in different regions of the wafer, enabling precise control of both radial and non-radial temperature non-uniformity.
Solution Approach 2:
Different cooling zones are assigned different temperature characteristics to address local temperature non-uniformity. The first cooling zone controls the central region, the second cooling zone controls the radial direction, and the third cooling zone controls the non-radial direction, allowing each region to have optimized temperature control tailored to its specific requirements.
2Productivity
If wafer size is enlarged to produce more dies, then productivity increases, but temperature uniformity control becomes more difficult and varies across non-radial locations
Solution Approach 1:
The cooling system is segmented into multiple zones that can be independently controlled, allowing each zone to be optimized for different regions of larger wafers. This enables maintaining temperature uniformity across the entire wafer surface even as wafer size increases to 12 inches or 18 inches, thereby supporting higher productivity.
Solution Approach 2:
The invention extends temperature control from simple radial adjustment to three-dimensional spatial control by adding multiple cooling zones with independent temperature control. This enables control of temperature distribution in both radial and non-radial directions, accommodating the increased temperature uniformity requirements of larger wafers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved wafer temperature uniformity and reduces non-radial temperature non-uniformity, enabling more accurate temperature control and enhancing the quality of semiconductor wafers.
Implementation Method 1
a lamp array disposed in the insulating layer
Implementation Method 2
an electrostatic chuck (ESC) for holding a wafer
Data Source
AI summary
This invention discloses a reaction apparatus for wafer treatment, an electrostatic chuck and a wafer temperature control method, in the field of semiconductor processing. The electrostatic chuck comprises an insulating layer for supporting a wafer and a lamp array disposed in the insulating layer. Each lamp of the lamp array can be independently controlled to turn on and off and/or to adjust the output power. By controlling the on/off switch and/or output power of each lamp of the lamp array the temperature of the wafer held on the ESC is adjusted and temperature non-uniformity can be more favorably adjusted, greatly improving wafer temperature uniformity, particularly alleviating non-radial temperature non-uniformity.