Electrostatic Chuck Wiring Chamber Pressure Equalization
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Solution Overview
Problem
The adhesion between the base body and functional layer of an electrostatic chuck in a semiconductor reaction chamber is easily damaged due to pressure differences between the internal chamber and the wiring channel, affecting the installation effect and service life.
Innovation Solution
A pressure adjustment device, comprising an air extraction device and an air inflation device, is used to balance the pressure in the accommodation chamber and inner chamber, preventing damage from pressure differences and improving connection stability between the base body and functional layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck is used in a semiconductor reaction chamber with vacuum state, then the semiconductor processing can be performed, but the pressure difference between the inner chamber and wiring channel damages the adhesion between base body and functional layer
Solution Approach 1:
The patent divides the electrostatic chuck into separate pressure zones: the accommodation chamber containing the wiring channel is pressure-separated from the inner chamber. This segmentation allows independent pressure control of each zone, preventing the pressure difference from damaging the adhesion between the base body and functional layer while maintaining vacuum in the inner chamber for semiconductor processing.
Solution Approach 2:
The patent introduces a pressure adjustment device as an intermediary between the accommodation chamber and the outer environment. This device regulates the pressure in the accommodation chamber to match the inner chamber pressure, acting as a mediator that eliminates the harmful pressure difference without affecting the vacuum state required for semiconductor processing.
2Ease of operation
If the wiring channel is provided in the base body for functional wire passage, then the electrostatic chuck can be controlled, but the atmospheric pressure in the wiring channel creates force against the vacuum state in the chamber
Solution Approach 1:
The patent segments the pressure environment by creating a separate accommodation chamber that houses the wiring channel. This allows the wiring channel to be pressure-isolated from the main inner chamber, enabling atmospheric pressure in the wiring channel for easy wire passage and control operations, while the inner chamber maintains vacuum state for semiconductor processing, without the pressure difference damaging the structure.
3Reliability
If the functional layer covers the end opening of the connection wire channel to form accommodation chamber, then the wiring is protected, but the pressure difference damages the bonding between base body and functional layer
Solution Approach 1:
The patent introduces a pressure adjustment device as an intermediary system that actively regulates the pressure in the accommodation chamber. This mediator balances the pressure between the accommodation chamber and the inner chamber, eliminating the pressure difference that would otherwise damage the bonding between the base body and functional layer, while maintaining the protective enclosure for the functional wire.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pressure adjustment device ensures equal pressure in both chambers, enhancing the adhesion and connection stability of the electrostatic chuck, thereby improving its service life and installation reliability.
Implementation Method 1
The pressure adjustment device communicates with the accommodation chamber and is configured to balance a pressure in the accommodation chamber and a pressure in the inner chamber
Data Source
AI summary
Embodiments of the present disclosure provide a semiconductor reaction chamber, including a chamber body, an electrostatic chuck, a functional wire, and a pressure adjustment device. The chamber body includes an inner chamber. The electrostatic chuck is located in the inner chamber and includes a base body and a functional layer. The base body includes a connection wire channel. The functional layer is arranged on the base body. The base body and the functional layer are fixed by bonding. The functional layer covers an end opening of the connection wire channel and forms an accommodation chamber with the base body. The functional wire passes through the connection wire channel and is in contact with the functional layer. The pressure adjustment device communicates with the accommodation chamber and is configured to balance a pressure in the accommodation chamber and a pressure in the inner chamber.


