ESD Protection for Biometric Sensor Platen

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Solution Overview

Problem

Capacitive fingerprint sensors are vulnerable to electrostatic discharge (ESD) from fingers, which can damage sensitive electronic components, and conventional methods to dissipate ESD are inadequate, especially in environments with high voltages.

Innovation Solution

A raised molded structure surrounding the fingerprint sensor platen with conductive structures that are grounded and positioned to encourage electrostatic discharge to occur before the finger contacts the platen, reducing the risk of damage to sensitive components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electrodes or metal grids are placed underneath the sensor to dissipate electrostatic charge, then current distribution is improved, but ESD protection effectiveness deteriorates because substantial ESD effect or damage may still occur to sensitive components not in adequate proximity to the electrodes or grid

Engineering Contradiction:
ImproveESD protection effectivenessVSAvoidESD damage to sensitive components
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by positioning conductive structures above the platen surface to dissipate electrostatic charge from the finger before it contacts the sensor. This pre-dissipation approach prevents ESD damage to sensitive components rather than attempting to distribute damage after contact occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary structure (raised molded structure with conductive elements) positioned between the finger and the sensor platen. This intermediary dissipates ESD charge from the approaching finger before contact, protecting the sensor without requiring the finger to directly contact protected components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the platen surface is kept clean and accessible for finger contact, then sensor operation is improved, but ESD vulnerability increases because the platen is directly exposed to electrostatic charge from the finger

Engineering Contradiction:
Improvesensor accessibilityVSAvoidESD exposure
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent extends ESD protection into a third dimension by placing conductive structures above the platen surface rather than only underneath. This vertical extension creates a protective zone that dissipates charge before contact while maintaining the platen's accessibility for finger placement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive structures perform preliminary ESD dissipation in the space above the platen, protecting the sensor before finger contact occurs. This maintains ease of operation while reducing ESD vulnerability through advance charge dissipation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively dissipates ESD prior to finger contact, protecting sensitive components from damage and ensuring proper sensor operation, even in environments with high electrostatic charges.

Implementation Method 1

conductive structures within the raised molded structure will be able to stimulate or otherwise encourage electrostatic activity prior to the conductive traits of the platen doing so itself

Methodology Applied
Scientific EffectCorona discharge: Corona Discharge

Implementation Method 2

conductive structures are positioned in a manner such that their end portions are substantially flush against (e.g., almost protruding completely through) the surface, of the raised molded structure

Methodology Applied
Scientific EffectDielectric breakdown: Avalanche Breakdown

Data Source

PatentUS7545621B2Electrostatic discharge structure for a biometric sensor
Publication Date: 2009.06.09 PHILIPS NORTH AMERICA LLC
  • US7545621B2 patent drawing
  • US7545621B2 patent drawing
  • US7545621B2 patent drawing

AI summary

A structure for reducing or eliminating electrostatic discharge from a finger into the platen of a biometric sensor is disclosed. The structure is designed to be positioned above and around the platen such that conductive components in the structure stimulate corona discharge and dielectric breakdown from an approaching finger into the conductive components of the structure rather than into the platen itself. The structure is designed to eliminate, reduce or otherwise neutralize the charge on an approaching finger prior to the finger coining into contact with the platen of the biometric sensor and prior to the finger coming close enough to the platen so that the electrostatic discharge causes an are to strike the platen.