ESD Protective Bonding Pad Structure for LED Transfer
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Solution Overview
Problem
Electronic devices are vulnerable to damage from electrostatic discharge (ESD) during the transfer of light emitting units from a carrier substrate to an object substrate, which can lead to production yield reduction and device failure.
Innovation Solution
Incorporating an electrostatic discharge protective unit in the pick-and-place tool, carrier substrate, and object substrate, which includes conductive metal wires and switching elements to ground bonding pads and reduce ESD-generated damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light emitting units are transferred from carrier substrate to object substrate, then production efficiency is improved, but electrostatic discharge damage occurs
Solution Approach 1:
An electrostatic discharge protective unit is introduced as an intermediary component between the light emitting units and the object substrate. This protective unit includes a protective electrode that forms an electrostatic discharge protection structure, acting as a mediator to divert and dissipate electrostatic charges before they can damage the light emitting units or bonding pads during the transfer process
Solution Approach 2:
The electrostatic discharge protective unit is activated before the actual bonding process occurs. By pre-establishing the protective electrostatic field and grounding path through the protective electrode, the system creates preliminary protection against upcoming electrostatic discharge events during unit transfer and bonding operations
2Reliability
If electrostatic discharge protective unit is added, then device reliability is improved, but device complexity increases
Solution Approach 1:
The electrostatic discharge protective unit is merged with the object substrate structure, sharing the same substrate and integrating the protective electrode into the existing device architecture. This combining approach adds protection functionality while minimizing the increase in overall device complexity by reusing existing structural elements
Solution Approach 2:
The protective electrode structure serves multiple functions: it provides electrostatic discharge protection during unit transfer, acts as an electrical connection path to ground, and integrates with the bonding pad structure. This multi-functionality reduces the need for separate dedicated protection components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of electrostatic discharge protective units effectively reduces the risk of damage to light emitting units and the object substrate during the transfer process, thereby enhancing the reliability and quality of electronic devices.
Implementation Method 1
electrostatic discharge protective unit to protect the electronic device from damage by an electrostatic discharge
Implementation Method 2
which includes conductive metal wires and switching elements to ground bonding pads
Data Source
AI summary
An electronic device includes an object substrate, an electronic unit and an electrostatic discharge protective unit. The object substrate includes a bonding pad. The electronic unit includes an electrode bonding on the bonding pad. The electrostatic discharge protective unit is located in the object substrate and electrically connected to the bonding pad.