Multilayer Capacitor ESD Protection via Side-Mounted Discharge Member

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Solution Overview

Problem

Existing electronic components face challenges in effectively managing electrostatic discharge (ESD) due to the increasing prevalence of IoT devices, leading to potential damage from human contact and limitations in mounting height and equivalent series inductance (ESL) when traditional ESD protection methods are applied.

Innovation Solution

Incorporating an ESD discharge member with a substrate, external terminals, emission electrodes, and an ESD function portion on one side surface of a multilayer capacitor perpendicular to the mounting surface, which bypasses ESD without increasing chip thickness or ESL, using materials like ceramics or PCBs, and adjusting the interval between emission electrodes to optimize ESD turn-on voltage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional ESD protection methods are applied, then ESD protection is provided, but mounting height increases and equivalent series inductance (ESL) increases

Engineering Contradiction:

ImproveESD protectionVSAvoidmounting height

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The ESD discharge member is disposed on a side surface of the multilayer capacitor perpendicular to the mounting surface, transitioning from a planar mounting approach to a three-dimensional spatial arrangement. This allows ESD protection functionality to be added without increasing the footprint area on the mounting board, effectively resolving the contradiction between providing ESD protection and maintaining compact mounting height

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If traditional ESD protection methods are applied, then ESD protection is provided, but equivalent series inductance (ESL) increases

Engineering Contradiction:

ImproveESD protectionVSAvoidequivalent series inductance

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The ESD discharge member is integrated with the multilayer capacitor by disposing it on the side surface and connecting through external electrodes, merging the ESD protection function with the capacitor structure. This integration reduces the overall inductance compared to separate discrete ESD components, effectively resolving the contradiction between providing ESD protection and minimizing ESL

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If ESD discharge member is added to control ESD, then ESD protection is improved, but device complexity increases

Engineering Contradiction:

ImproveESD protectionVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The side surface of the multilayer capacitor serves dual purposes: maintaining the capacitor's electrical function and providing a mounting surface for the ESD discharge member. The external electrodes serve both to connect the capacitor to the circuit and to connect the ESD member. This multi-functionality reduces overall device complexity while providing ESD protection

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively controls ESD without increasing chip thickness or ESL, allowing for broader application in restricted mounting environments while maintaining capacitance performance.

Implementation Method 1

The ESD discharge member may be a varistor

Methodology Applied

Scientific EffectVaristor effect: Avalanche Breakdown

Data Source

PatentUS11640877B2Electronic component and board having the same

Publication Date: 2023.05.02 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An electronic component includes: a multilayer capacitor including a capacitor body and first and second external electrodes respectively disposed on opposing end surfaces of the capacitor body; and an ESD member disposed on a first side surface of the multilayer capacitor perpendicular to a mounting surface of the multilayer capacitor, such that the ESD of the multilayer capacitor may be effectively controlled.