Electrostatic Discharge Defect Evaluation Using Charged Map Simulation
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Solution Overview
Problem
During the manufacturing process of display devices, defects due to electrostatic discharge are difficult to evaluate accurately, especially on non-conductive substrates, as direct voltage application can lead to misidentification of defect locations and inefficiencies in electrostatic discharge tolerance evaluation.
Innovation Solution
A defect evaluation method and device using a voltage gradient to simulate electrostatic discharge on a test object by creating a charged map and applying voltage to a test pattern, which includes metal rods or plates, to induce and detect defects, allowing for the derivation of optimal process conditions and robust structure design against electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If direct voltage is applied to evaluate electrostatic discharge defects, then the evaluation process is simple, but the measurement precision is poor due to misidentification of defect locations on non-conductive substrates
Solution Approach 1:
The patent introduces a charged map as an intermediary representation that captures the electrostatic charge distribution on the non-conductive substrate. This charged map serves as a mediator between the applied voltage and the actual defect locations, allowing accurate defect identification without directly applying voltage to the non-conductive substrate. The charged map translates the complex electrostatic field into a measurable pattern that reveals true defect locations.
2Reliability
If voltage is applied to simulate electrostatic discharge on non-conductive substrates, then defect evaluation can be performed, but the reliability is poor due to inaccurate defect detection
Solution Approach 1:
The patent performs preliminary action by creating a charged map that represents the electrostatic charge distribution before applying voltage for defect evaluation. This pre-established charged map provides an accurate reference for comparing defect patterns, enabling reliable electrostatic discharge tolerance evaluation. The preliminary charged map preparation ensures that subsequent voltage application accurately reflects real electrostatic discharge conditions without causing measurement errors.
3Ease of manufacture
If conventional voltage application methods are used, then the process is straightforward, but the manufacturing precision deteriorates due to inability to accurately identify vulnerable areas
Solution Approach 1:
The patent creates a copied representation of the electrostatic charge distribution through the charged map, which replicates the charge pattern without requiring direct voltage application to the substrate. This copying approach maintains manufacturing simplicity while dramatically improving vulnerable area identification accuracy. The charged map serves as an accurate copy of the electrostatic field that can be analyzed to identify precise defect locations and vulnerable areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively simulates and evaluates defects caused by electrostatic discharge, enabling the identification of vulnerable areas and optimizing process conditions to improve the robustness of display devices against such defects, thereby enhancing manufacturing efficiency and product quality.
Implementation Method 1
defect evaluation method for evaluating a defect due to electrostatic discharge
Implementation Method 2
A defect evaluation method and device using a voltage gradient to simulate electrostatic discharge on a test object
Data Source
AI summary
A defect evaluation method for evaluating a defect due to electrostatic discharge includes obtaining a charged map of a lower part of a test object, preparing a test pattern simulating the charged map of the lower part of the test object, contacting the test object to the test pattern, and applying a voltage to the test pattern. Accordingly, to simulate and evaluate the defect that may occur during a manufacturing process of the test object in advance. In addition, using a result obtained by the simulation and the evaluation, an arrangement of a portion vulnerable to the defect of a structure in the test object may be changed.


