Integrated ESD Filter Component Reducing Parasitic Inductance

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Solution Overview

Problem

Conventional ESD protection circuits occupy large space and fail to achieve desired filter characteristics due to individual mounting of inductor, varistor, and capacitor components on a base circuit board, leading to increased parasitic inductance and electrical coupling.

Innovation Solution

A compact filter component with an ESD protection function is designed, where an inductor is mounted on a semiconductor substrate with an ESD protection element and capacitor formed on the substrate, reducing parasitic inductance and electrical coupling by integrating these components on a shared base board, and using a metal-insulator-metal capacitor with ferroelectric layers for high capacitance and reduced loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If inductor, varistor, and capacitor are individually mounted on base circuit board, then ease of manufacture is improved, but device area increases and filter characteristics deteriorate

Engineering Contradiction:
Improveease of manufactureVSAvoiddevice area
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent combines multiple discrete components (inductor, varistor, capacitor) into a single integrated filter component structure. The inductor is mounted on a base board that also carries the varistor and capacitor in fixed positions, merging what would otherwise be separate mounted components into one unified assembly that occupies less board space while maintaining manufacturability through standardized mounting procedures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The base board serves multiple functions simultaneously: it acts as the mounting substrate for the inductor, provides fixed mounting positions for the varistor and capacitor, establishes electrical connections through conductive patterns, and provides mechanical support for the entire filter component. This multi-functionality reduces the need for additional supporting structures and minimizes overall device area.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If inductor, varistor, and capacitor are individually mounted on base circuit board, then ease of manufacture is improved, but filter characteristics deteriorate due to increased parasitic inductance

Engineering Contradiction:
Improveease of manufactureVSAvoidfilter characteristics
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts the inductor from the standard PCB mounting approach and mounts it directly on a specialized base board with optimized conductor patterns. This separation allows the inductor to be positioned optimally for filter performance while the base board's conductive patterns provide low-parasitic connection paths, achieving better filter characteristics without sacrificing manufacturability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The base board acts as an intermediary between the inductor and the varistor/capacitor, providing optimized electrical connection paths through its conductive patterns. This intermediary structure minimizes parasitic inductance by creating direct, low-impedance connection routes while maintaining ease of assembly through standardized mounting interfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If components are connected by wiring conductors on base circuit board, then ease of manufacture is improved, but parasitic inductance increases

Engineering Contradiction:
Improveease of manufactureVSAvoidparasitic inductance
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent replaces traditional wiring conductor connections with integrated conductive patterns formed directly on the base board. This substitution eliminates the need for separate wire connections, reducing the number of connection points and minimizing parasitic inductance while maintaining ease of manufacture through standardized PCB fabrication processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from three-dimensional wire connections to two-dimensional planar conductive patterns on the base board. This dimensional change allows for optimized current paths that minimize loop areas and parasitic inductance, while the conductive patterns can be easily fabricated using standard PCB techniques.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a smaller, more reliable filter component with improved filter characteristics and reduced parasitic inductance, achieving both ESD protection and low-pass filtering functions while minimizing space and electrical coupling.

Implementation Method 1

a capacitor formed in the base board, preferably a metal-insulator-metal capacitor in which ferroelectric bodies and planar conductor patterns are alternately arranged and laminated together

Methodology Applied
Scientific EffectDielectric polarization: Dielectric

Data Source

PatentUS10855074B2Filter component having ESD protection function
Publication Date: 2020.12.01 MURATA MFG CO LTD
  • US10855074B2 patent drawing
  • US10855074B2 patent drawing
  • US10855074B2 patent drawing

AI summary

A filter component having an ESD protection function that includes a mounting inductor component and a base board. An ESD protection element and a capacitor are formed in the base board, which includes a semiconductor substrate, and front and back rewiring layers. First and second mounting component connection terminal conductors to which the mounting inductor component is connected are formed on an outer surface of the front rewiring layer. Moreover, a first, second and third external connection terminal conductors are formed on an outer surface of the back rewiring layer. The ESD protection element is formed in the semiconductor substrate and the capacitor is formed in one of the front rewiring layer or the back rewiring layer.