3DIC ESD Protection Test Interface Using Dispersive Dummy Probe Card
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Three-dimensional integrated circuits (3DICs) and associated test equipment are vulnerable to electrostatic discharge (ESD) during testing, which can cause performance degradation or failure due to the complex structure and varying process techniques used in their fabrication, leading to damage of sensitive components and equipment.
Innovation Solution
A reusable ESD dispersive dummy probe card and socket assembly with metallic shielding are employed to provide a path for discharging static electricity, protecting both the 3DICs and test equipment by using a conductive substrate and grounding structure to divert ESD current and charges, thereby preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional probe card assemblies with metallic bonding pads and solder connections are used for 3DIC testing, then electrical connection and signal transfer are achieved, but the system becomes vulnerable to electrostatic discharge (ESD) damage
Solution Approach 1:
The patent introduces an ESD protection circuit as an intermediary component between the probe card and the 3DIC device. This circuit includes ESD protection devices (such as diodes or transistors) that are specifically designed to intercept and dissipate electrostatic discharge before it reaches sensitive components. The ESD protection circuit acts as a mediator that allows normal signal transmission while blocking harmful ESD events.
Solution Approach 2:
The patent employs ESD protection devices that deliberately provide a controlled path for ESD current to flow through safe components. By designing the circuit to intentionally conduct ESD through specific protection elements (such as clamping diodes or transient voltage suppression devices), the harmful ESD energy is converted into a controlled dissipation process that protects the overall system. The harm of ESD is thus transformed into a manageable event that can be safely handled by dedicated protection components.
2Productivity
If 3DIC structures with multiple chip layers and varying process techniques are implemented to increase circuit performance, then circuit performance and functionality are improved, but the complexity of ESD protection requirements increases
Solution Approach 1:
The patent divides the ESD protection function into multiple segments corresponding to different chip layers and interconnect structures. Each segment of the ESD protection circuit is specifically designed to protect particular layers or interconnect types (such as TSVs, Cu interconnects, or Al interconnects). This segmentation allows the complex ESD protection requirement to be broken down into manageable, layer-specific protection schemes that can be independently optimized and implemented.
Solution Approach 2:
The patent implements ESD protection with local quality by tailoring the protection characteristics to specific regions and layers of the 3DIC structure. Different ESD protection devices and configurations are applied to different chip layers based on their specific vulnerability to ESD. For example, lower layers with TSVs may receive different protection than upper layers with fine-pitch interconnects. This localized approach optimizes ESD protection for each specific structural characteristic rather than applying a uniform solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of ESD-induced damage, enhancing the lifespan of test equipment and improving test quality by providing a safe discharge path for static electricity, thus ensuring the integrity of sensitive components during the testing process.
Implementation Method 1
high-voltage static electricity or noises, commonly referred to as electrostatic discharge (ESD), can pass through the package and/or test equipment
Implementation Method 2
using a conductive substrate and grounding structure to divert ESD current and charges
Data Source
AI summary
The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.