ESD Protection Circuit Using Transistor Segmentation and Current Limiting

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Solution Overview

Problem

Deep-submicron CMOS Integrated Circuits are increasingly vulnerable to electrostatic discharge (ESD) due to reduced device size and gate oxide thickness, necessitating effective ESD protection circuits that can prevent transistor breakdown and oxide damage.

Innovation Solution

The implementation of an ESD protection circuit comprising a first and second transistor, with a current limiting element, where at least one transistor operates in MOS mode to discharge ESD events at low voltage, preventing breakdown and enhancing discharge efficiency through the MOS body effect, and a two-stage protection scheme with a primary and secondary ESD stage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If device size and gate oxide thickness are reduced to improve operating speed and integration density, then operating speed and integration density are improved, but vulnerability to ESD damage increases

Engineering Contradiction:
Improveoperating speedVSAvoidvulnerability to ESD damage
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The ESD protection circuit is segmented into multiple functional components: a first transistor for initial ESD discharge, a second transistor for sustained discharge, and a current limiting element. This segmentation allows each component to handle specific aspects of ESD protection, enabling effective protection against ESD damage while maintaining the benefits of scaled-down device dimensions for high operating speed and integration density.

Inventive Principle:
Principle #1Segmentation

2Reliability

If conventional ESD protection circuits are used to protect against ESD damage, then ESD protection is provided, but transistor breakdown and oxide damage occur during ESD events

Engineering Contradiction:
ImproveESD protection capabilityVSAvoidtransistor breakdown resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The first transistor is configured to activate before the second transistor during an ESD event. The first transistor provides initial ESD discharge capability, preventing voltage from reaching breakdown levels that would damage the second transistor or protected circuitry. This preliminary action ensures that ESD protection is established before damage can occur.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The current limiting element acts as an intermediary between the ESD protection transistors and the protected circuitry. It limits the discharge current to prevent excessive current from causing oxide damage or transistor breakdown, while still allowing sufficient current to flow to discharge the ESD event effectively.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Power

If transistors are operated at high voltage during ESD events to enhance discharge capability, then ESD discharge capability is improved, but transistor breakdown and oxide damage occur

Engineering Contradiction:
ImproveESD discharge capabilityVSAvoidoxide damage resistance
Core Design Contradiction:
PowerVSStrength

Solution Approach 1:

The ESD protection circuit dynamically transitions between different transistor operating states during an ESD event. The first transistor activates initially to handle the voltage spike, then the second transistor engages for sustained discharge. The current limiting element dynamically adjusts the discharge current to maintain it within safe limits throughout the ESD event, preventing oxide damage while maintaining effective discharge capability.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents transistor breakdown and oxide damage by ensuring transistors operate in MOS mode at low voltage, enhancing ESD discharge efficiency and protecting circuitry from damaging voltages, even in thin gate oxide transistors.

Implementation Method 1

at least one transistor operates in MOS mode to discharge ESD events at low voltage, preventing breakdown and enhancing discharge efficiency through the MOS body effect

Methodology Applied
Scientific EffectMOS body effect:

Data Source

PatentUS8315024B2Electrostatic discharge protection circuit, integrated circuit and method of protecting circuitry from an electrostatic discharge voltage
Publication Date: 2012.11.20 INFINEON TECHNOLOGIES AG
  • US8315024B2 patent drawing
  • US8315024B2 patent drawing
  • US8315024B2 patent drawing

AI summary

Implementations are presented herein that include an electrostatic discharge (ESD) protection circuit. The ESD protection circuit includes a first transistor and a second transistor. The first transistor has a first terminal that is coupled to a first supply line and a bulk that is coupled to a second supply line. The second transistor has a first terminal that is coupled to the second supply line, a bulk that is coupled to the first supply line and a second terminal that is coupled to a second terminal of the first transistor to define a protected node. The ESD protection circuit further includes a current limiting element that has a first terminal that is coupled to the protected node.