ESD Protection Device Sealing Layer Ceramic Base
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Solution Overview
Problem
Existing ESD protection devices face challenges such as limited discharge capacity, short circuit defects, complex manufacturing processes, and increased costs due to the limitations of microgap formation and the use of ceramic substrates, which affect the reliability and productivity of semiconductor protection.
Innovation Solution
An ESD protection device with a ceramic base material, opposed electrodes, and a discharge auxiliary electrode connected by a sealing layer that prevents glass component ingress, along with a reactive layer formed by the reaction between the sealing layer and ceramic base material, ensuring a reliable and stable discharge capacity without special manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hollow section is formed by stacking perforated sheets to provide microgap, then the discharge space is created, but stacking accuracy limitation prevents size reduction
Solution Approach 1:
The complex stacking process is replaced by directly forming the microgap structure within a single ceramic base material. The discharge auxiliary electrode is formed to extend toward the opposed electrode, creating the necessary discharge space without requiring multiple stacked components.
Solution Approach 2:
The ceramic base material integrates multiple functions: it provides structural support, contains the discharge space, and when combined with the sealing layer, prevents glass penetration. This composite structure eliminates the need for separate stacked perforated sheets.
2Reliability
If enclosed space with inert gas is encapsulated to protect from ESD, then the surge absorption capacity is increased, but manufacturing process becomes complicated and productivity decreases
Solution Approach 1:
The discharge auxiliary electrode is formed to extend toward the opposed electrode within the same ceramic base material, merging the electrode structure with the substrate. This integration eliminates the need for separate encapsulation steps and complex assembly processes.
Solution Approach 2:
The ceramic base material itself provides the discharge space and structural support, eliminating the need for external encapsulation with inert gas. The structure is self-sufficient, reducing manufacturing complexity while maintaining surge absorption capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances discharge capacity, reduces short circuit defects, simplifies the manufacturing process, and improves productivity by preventing glass component ingress and excessive sintering, resulting in a high-reliability ESD protection device with stable characteristics under repeated static electricity applications.
Implementation Method 1
a sealing layer for preventing ingress of the glass component from the ceramic base material into the discharge auxiliary electrode is provided between the discharge auxiliary electrode and the ceramic base material
Implementation Method 2
a reactive layer including a reaction product formed by a reaction between a constituent material of the sealing layer and a constituent material of the ceramic base material is provided at the interface between the sealing layer and the ceramic base material
Implementation Method 3
a discharge auxiliary electrode connected to each of the opposed electrode on one side and the opposed electrode on the other side constituting the opposed electrodes, the discharge auxiliary electrode placed so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side
Implementation Method 4
opposed electrodes which each has a microgap in the same plane
Implementation Method 5
electrons need to jump over directly between the microgaps of the opposed electrodes
Data Source
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AI summary
An object of the present invention is to provide an ESD protection device which is excellent in discharge capacity, at the same time, causes fewer short circuit defects, requires no special step for manufacture, and is excellent in productivity, and a method for manufacturing the ESD protection device. In an ESD protection device including: a ceramic base material including a glass component; opposed electrodes including an opposed electrode on one side and an opposed electrode on the other side, which are formed so as to have their ends opposed to each other on the surface of the ceramic base material; and a discharge auxiliary electrode between the opposed electrodes, which is connected to each of the opposed electrode on one side and the opposed electrode on the other side, and placed so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side, a sealing layer for preventing the ingress of the glass component from the ceramic base material into the discharge auxiliary electrode is provided between the discharge auxiliary electrode and the ceramic base material. In addition, in the ESD protection device, a reactive layer including a reaction product formed by the reaction between the constituent materials of the sealing layer and ceramic base material is provided at the interface between the sealing layer and the ceramic base material.