Electrostatic Discharge Structure for Semiconductor Package
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Solution Overview
Problem
During the die attach process in semiconductor package manufacturing, highly electrostatic charges are generated, which can damage logic chips due to insufficient electrostatic discharge management by existing ionizer systems.
Innovation Solution
An electrostatic discharge structure is formed on a ground substrate pad between semiconductor devices, allowing safe discharge of electrostatic charges through a grounded path, preventing damage to the first semiconductor device and improving product yield and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an ionizer is used to remove electrostatic charges during the die attach process, then electrostatic charge removal is attempted, but the capability is insufficient and management is difficult, causing damage to logic chips
Solution Approach 1:
The harmful electrostatic charges are extracted and directed to a specific discharge path through the electrostatic discharge structure. The structure includes a discharge electrode that extracts charges from the adhesive film peeling process and guides them to a ground substrate pad, separating the charge dissipation function from the chip operation area.
Solution Approach 2:
The electrostatic discharge structure acts as an intermediary between the adhesive film and the logic chip. It provides a controlled path for electrostatic charges generated during adhesive film peeling, preventing direct discharge onto the chip while safely directing charges to ground through the substrate pad.
2Adaptability or versatility
If multiple semiconductor chips are stacked on a package substrate, then device functionality is improved, but electrostatic charges generated during die attach process increase the risk of damage
Solution Approach 1:
The electrostatic discharge structure is prepared in advance on the package substrate before the die attach process begins. The discharge electrode and ground substrate pad are pre-positioned to ensure that when multiple chips are stacked and adhesive films are peeled, charges have an immediate safe path available.
Solution Approach 2:
The harmful electrostatic charges generated during the die attach process of stacked chips are converted into a beneficial controlled discharge through the electrostatic discharge structure. Instead of allowing random discharge that could damage chips, the structure channels charges through a designated path to ground, transforming a harmful byproduct into a controlled process feature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic discharge structure effectively manages electrostatic charges, preventing damage to the first semiconductor device and enhancing the yield and productivity of semiconductor packages by ensuring safe discharge during the die attach process.
Implementation Method 1
highly electrostatic charges may be generated when an adhesive film peels off from an underlying based film
Implementation Method 2
forming an electrostatic discharge structure on a ground substrate pad exposed from an upper surface of the package substrate
Data Source
AI summary
In a method of manufacturing a semiconductor package, a first semiconductor device is arranged on a package substrate. An electrostatic discharge structure is formed on at least one ground substrate pad exposed from an upper surface of the package substrate. A plurality of second semiconductor devices is stacked on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices. A molding member is formed on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices.