On-Die ESD Testing Structure for 3DIC Bonding Precision
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Solution Overview
Problem
Current external testing devices are limited in precisely determining the location and magnitude of electrostatic discharge (ESD) events during semiconductor manufacturing, particularly in three-dimensional integrated circuits (3DIC) and 2.5-dimensional integrated circuits (2.5DIC) bonding processes, which can lead to damage and reduced production yield.
Innovation Solution
Incorporating an array of ESD testing structures directly on the die, which measure current and/or voltage at the site of discharge, allowing for precise data collection and potential integration as a protection structure to mitigate damage during bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external testing devices are used to measure ESD events, then the IC can be protected from contact during the ESD event, but the precision of determining the location and magnitude of the ESD event is reduced
Solution Approach 1:
The patent introduces an on-die measurement device as an intermediary element that is integrated into the IC structure. This measurement device includes a sensor coupled to a bonding pad that directly detects ESD events at the bonding interface, serving as a mediator between the ESD event and the external testing device. The sensor converts the ESD event parameters into measurable signals that can be read by external equipment, thereby maintaining protection while improving measurement precision.
Solution Approach 2:
The patent transitions from external remote measurement to internal on-die measurement by adding a new dimension of measurement capability directly at the ESD event location. The measurement device is embedded within the IC structure at the bonding pad level, enabling three-dimensional integration of sensing, measurement, and protection functions within the IC package itself.
2Ease of operation
If external testing devices remotely measure ESD events, then contact with the IC is avoided, but accurate data collection on ESD events is limited
Solution Approach 1:
The measurement device acts as an intermediary that captures ESD event information directly at the source (bonding pad) and transmits it to external testing devices. The sensor on the die converts ESD parameters into electrical signals that can be read externally without requiring physical contact during the ESD event, thus preserving both ease of operation and information accuracy.
Solution Approach 2:
The patent implements a feedback mechanism where the measurement device continuously monitors ESD events and provides real-time data about charge buildup and discharge characteristics. This feedback loop enables external systems to adjust protection measures and process parameters based on actual ESD event data, improving both operational ease and information accuracy.
Data Source
AI summary
A method of making an electrostatic discharge (ESD) testing structure includes forming, in a first die, a first measurement device. The method further includes forming, in a second die, a fuse, a first trim pad, and a second trim pad. The method further includes forming, between the first die and the second die, a plurality of electrical bonds, wherein a first bond of the plurality of bonds is electrically connected to the first trim pad and a first side of the fuse, and a second bond of the plurality of bonds is electrically connected to the second trim pad and a second side of the fuse.