Envelope Tracking Amplifier Array with Distributed Voltage Amplifier
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
5G-NR capable mobile communication devices using millimeter wave RF spectrum face challenges with RF signal attenuation and interference, leading to excessive heat dissipation in amplifier arrays due to suboptimal efficiency.
Innovation Solution
An envelope tracking (ET) apparatus with a distributed voltage amplifier (DVA) circuit and a signal processing circuit that generates ET voltage based on an analog signal, reducing trace inductance and footprint while maintaining efficiency and minimizing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If amplifier array operates at high power in mmWave spectrum, then data rate and coverage are improved, but heat dissipation increases due to suboptimal efficiency
Solution Approach 1:
The patent applies envelope tracking technology that dynamically adjusts the supply voltage to the amplifier array based on the instantaneous power requirements of the RF signal. By changing the voltage parameter in real-time to match the signal envelope, the system maintains high efficiency across varying power levels, reducing heat dissipation while preserving high data rate capability in mmWave spectrum
Solution Approach 2:
The system transitions from static power amplification to dynamic envelope tracking, where the supply voltage continuously adapts to the modulated RF signal characteristics. This dynamic operation allows the amplifier to maintain optimal efficiency by adjusting its operating point in real-time, preventing excessive heat generation during high-power transmission while supporting 5G-NR data rate requirements
2Reliability
If distributed voltage amplifier circuit is co-located with amplifier array, then trace inductance is reduced, but device footprint increases
Solution Approach 1:
The patent integrates the distributed voltage amplifier circuit directly with the amplifier array by co-locating them on the same substrate or package. This merging of previously separate components minimizes the trace inductance between the voltage amplifier and power amplifiers, improving efficiency while the integrated design approach manages the footprint through shared infrastructure and compact layout strategies
Data Source
AI summary
An envelope tracking (ET) apparatus is provided. The ET apparatus includes an amplifier array(s) configured to amplify a radio frequency (RF) signal(s) based on an ET voltage(s). The ET apparatus also includes a distributed voltage amplifier (DVA) circuit(s), which may be co-located with the amplifier array(s) to help reduce trace inductance between the DVA circuit(s) and the amplifier array(s), configured to generate the ET voltage(s) based on an ET target voltage(s). The ET apparatus further includes a signal processing circuit configured to receive an analog signal(s) corresponding to the RF signal(s) and generates the ET target voltage(s) based on the analog signal. By employing a single signal processing circuit to generate the ET target voltage(s) for the amplifier array(s), it may be possible to reduce a footprint of the ET apparatus without compromising efficiency and/or increasing heat dissipation of the amplifier array(s).