Etch-Resistant Resin Composition for Nanoimprint
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Solution Overview
Problem
Existing resins for optical and electronic components lack sufficient heat resistance and dimensional stability, leading to deformation and dimensional changes during device operation.
Innovation Solution
A composition with a dry etching rate of equal to or less than 140 nm/min, characterized by specific viscosity and Ohnishi parameter ranges, containing compounds with cyclic moieties and polymerizable groups, suitable for photo-curable and nanoimprint applications, is developed to form etch-resistant resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing resins are used for optical and electronic components, then manufacturing is simpler, but heat resistance and dimensional stability are insufficient leading to deformation during operation
Solution Approach 1:
The patent applies parameter changes by precisely controlling the molecular structure parameters of the resin, specifically limiting the Ohnishi parameter to 2.60 or less and viscosity to 104800 mPa·s or less. These parameter adjustments enable the resin to achieve exceptional heat resistance and dimensional stability while maintaining ease of manufacturing through standardized composition ratios and curing conditions.
2Productivity
If resin viscosity is reduced to improve filling time, then pattern filling speed increases, but resin strength and etch resistance may deteriorate
Solution Approach 1:
The patent resolves this contradiction through parameter optimization by setting viscosity within the specific range of 104800 mPa·s or less (preferably 81100 mPa·s or less, more preferably 6800 mPa·s or less). This parameter control enables rapid pattern filling while simultaneously maintaining adequate resin strength and etch resistance, achieving both high productivity and sufficient material performance.
Solution Approach 2:
The patent employs composite material principles by formulating a multi-component resin system consisting of specific monomers, oligomers, and additives in controlled ratios. This composite approach allows the resin to exhibit optimized rheological properties for fast filling while maintaining mechanical strength and chemical resistance through synergistic interactions among components.
3Manufacturing precision
If dry etching rate is reduced to achieve etch resistance, then pattern profile precision improves, but manufacturing time increases
Solution Approach 1:
The patent applies parameter changes by controlling the resin composition to achieve a dry etching rate of 140 nm/min or less under standardized plasma conditions (O2 flow rate of 10 sccm). This parameter optimization ensures precise pattern profiles with minimal etching time, balancing manufacturing precision with production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat resistance and dimensional stability, enabling the formation of etch-resistant resins suitable for nanoimprint technology and versatile in manufacturing components with precise pattern profiles and short filling times.
Implementation Method 1
With regard to the composition, it is preferred that the composition is photo-curable
Implementation Method 2
the dry etching rate is measured in a plasma generated under a condition in which a flow rate of O2 is 10 sccm
Implementation Method 3
the plasma is generated under the condition in which an intensity of a radio frequency generating the plasma is 350 W, a frequency of the radio frequency is 13.56 MHz
Data Source
AI summary
Compositions are for formation of etch-resistant resins. Such resins are useful for manufacturing components or devices.