Etch Chamber Wall Vibration for Polymer Buildup Removal
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Solution Overview
Problem
Plasma etching processes in semiconductor manufacturing generate polymer by-products that adhere to and contaminate the inner walls of etching chambers, leading to device failure and contamination when these particles delaminate and fall onto substrates.
Innovation Solution
A system utilizing oscillators driven by a microwave generator to mechanically vibrate the inner walls of the etching chamber, dislodging polymer particles, which are then collected and removed by a gas flow and pump, with a controller managing the frequency and duration of oscillations based on specific etching recipes to optimize cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma etching processes are used to form geometric patterns in semiconductor layers, then manufacturing precision is improved, but polymer by-products adhere to chamber walls causing contamination
Solution Approach 1:
The patent applies mechanical vibration through oscillators that attach to the chamber wall and vibrate at specific frequencies to mechanically dislodge polymer particles from the chamber surface. This vibration-based cleaning method directly addresses the contamination problem while preserving the benefits of plasma etching, as the oscillators are applied after the etching process completes.
Solution Approach 2:
The patent converts the harmful polymer deposits into a removable state by using controlled vibration frequencies that specifically target the adhesion forces holding polymers to the chamber wall. The same plasma process that creates the harmful polymers is followed by a vibration-based removal process that exploits the dynamic response of the polymer layer to mechanical oscillation.
2Productivity
If polymer particles delaminate and fall onto substrates, then device reliability deteriorates, but continuous operation is required for productivity
Solution Approach 1:
The patent implements preliminary cleaning action by removing polymer particles from the chamber wall before they can delaminate and contaminate substrates during subsequent processing. The oscillators are positioned and activated to prevent particle accumulation and delamination, thereby maintaining both continuous productivity and device reliability.
Solution Approach 2:
The system uses feedback control where sensors detect polymer particle accumulation on chamber walls and trigger the oscillator activation. This closed-loop approach ensures that cleaning is performed precisely when needed to prevent contamination, maintaining both continuous operation and high device reliability without unnecessary interruptions.
3Manufacturing precision
If oscillators are positioned close to chamber wall for effective vibration, then cleaning effectiveness is improved, but risk of particle generation increases
Solution Approach 1:
The patent uses periodic oscillation at carefully controlled frequencies and durations to dislodge polymers without excessive force. The oscillators operate in periodic cycles rather than continuously, allowing polymer particles to be gradually removed through repeated low-intensity vibrations rather than single high-intensity impulses that could generate additional particles.
Solution Approach 2:
The system dynamically adjusts oscillation parameters including frequency, amplitude, and duration based on the amount and type of polymer accumulation detected. By changing these parameters in real-time, the system optimizes cleaning effectiveness while minimizing the risk of generating additional particles through excessive vibration intensity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes polymer contaminants from the chamber walls, preventing device contamination and ensuring clean processing environments by using controlled vibrations to dislodge and remove particles during or after etching processes.
Implementation Method 1
A system utilizing oscillators driven by a microwave generator to mechanically vibrate the inner walls of the etching chamber, dislodging polymer particles
Implementation Method 2
which are then collected and removed by a gas flow and pump
Data Source
AI summary
In an etch process chamber, oscillators are positioned a predetermined distance away from an outer wall and coupled to a microwave generator. An inner wall of the process chamber on which particulates such as polymers adhere from the etch process is vibrated via operations of the oscillators. A gas flows into the cavity defined by the inner wall to collect the displaced particulates, which is then pumped out of the cavity to clean the process chamber. A controller identifies the polymer recipe used during the etch process and selects an oscillation program from memory. A microwave generator, controlled by the controller, is directed to generate microwaves at preselected frequencies determined from the program. The microwave frequencies are communicated to the oscillators, which then vibrate the inner wall at such received frequencies.