Etchant Composition for Wiring Substrate Profile Control
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Solution Overview
Problem
The existing etchant compositions for manufacturing wiring substrates face challenges in controlling the profile of driving signal wiring, particularly due to differences in etching properties of layered materials, leading to poor coverage and processability issues with high electrical resistance and thermal stability requirements.
Innovation Solution
An etchant composition comprising peroxosulfate, cyclic amine compounds, a first amphoteric compound with a carboxyl group, and a second amphoteric compound with a sulfone group, optimized in specific weight ratios and concentrations, is used to improve etching characteristics and control the profile of copper and titanium layers, ensuring low electrical resistance and high thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etchant compositions are used for etching layered metal structures, then the etching process can be performed, but the profile control of the etched wiring is poor due to different etching properties of different layers
Solution Approach 1:
The patent modifies the chemical composition parameters of the etchant by incorporating specific additives (amino acids, chelating agents, and other organic compounds) in controlled concentrations. These parameter changes enable the etchant to selectively adjust etching rates across different metal layers (copper, titanium, tungsten), achieving uniform profile control despite the inherent complexity of layered material properties.
2Reliability
If the side inclination angle of the driving signal wiring is increased to improve coverage, then coverage may be improved, but poor coverage occurs due to abrupt steps formed by the wiring
Solution Approach 1:
The etchant composition is designed to exhibit local quality by differentially affecting different regions of the layered structure. The additives in the etchant create localized chemical environments that modify etching behavior at specific interfaces and surfaces, enabling precise control over the side inclination angle and step profile of the etched wiring to achieve optimal coverage without abrupt steps.
3Productivity
If the etching rate is increased to improve manufacturing efficiency, then productivity increases, but the profile control and thermal stability of the wiring deteriorate
Solution Approach 1:
The etchant composition maintains continuous and uniform etching action across all metal layers through the synergistic effect of multiple additives. The amino acids and chelating agents ensure sustained complexation with metal ions throughout the etching process, allowing high etching rates to be maintained consistently without compromising profile control or thermal stability of the resulting wiring structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etchant composition effectively controls the etching rate and profile of copper and titanium layers, enhancing the manufacturing processability and electrical properties of wiring substrates while maintaining thermal stability and preventing over-etching.
Implementation Method 1
a peroxosulfate
Implementation Method 2
a cyclic amine compound
Implementation Method 3
a first amphoteric compound including a carboxyl group; and a second amphoteric compound including a sulfone group
Data Source
AI summary
An etchant composition may include: a peroxosulfate; a cyclic amine compound; a first amphoteric compound including a carboxyl group; and a second amphoteric compound including a sulfone group, wherein the second amphoteric compound may be different from the first amphoteric compound.