Etchant Composition Preventing Insoluble Precipitates in Display Manufacturing
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Solution Overview
Problem
Existing etching processes for display device manufacturing often result in the generation of insoluble precipitates during the etching of metal layers, which can lead to defects and reduced productivity due to the reaction between azole compounds and copper ions with chloride ions.
Innovation Solution
An etchant composition including persulfate, fluorine compound, inorganic acid, azole compound, electron-donating compound, chlorine compound, copper salt, and organic acid or salt, with specific weight percentages, is used to prevent the formation of insoluble precipitates by inhibiting nucleophilic reactions through the inclusion of electron-donating compounds like cyclic organic acids or their salts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional etching processes are used for metal layers, then etching can be performed, but insoluble precipitates are generated due to reactions between azole compounds and copper ions with chloride ions
Solution Approach 1:
The patent removes chloride ions from the etching solution to prevent the formation of insoluble precipitates. The etching solution is formulated without chloride-containing compounds, thereby eliminating the source of the harmful precipitation reaction while maintaining effective etching performance through alternative etchants.
Solution Approach 2:
The patent introduces an electron-donating compound as an intermediary substance that mediates between the azole compound and copper ions. This intermediary prevents the direct reaction that would form precipitates, allowing the etching process to proceed smoothly without generating harmful byproducts.
2Productivity
If existing etchant compositions are used, then etching can proceed, but productivity is reduced due to precipitate formation and associated defects
Solution Approach 1:
The patent eliminates chloride ions from the etching solution to prevent precipitate formation. This removal of the problematic component ensures process stability and prevents defects that would otherwise require rework or scrap, thereby improving manufacturing efficiency and productivity.
3Manufacturing precision
If azole compounds and chloride ions are both present in the etchant, then etching effectiveness is maintained, but harmful precipitates are generated
Solution Approach 1:
The patent removes chloride ions from the etching solution while retaining azole compounds. This selective extraction eliminates the harmful precipitate-forming reaction while preserving the beneficial etching action of the azole compound on copper metal layers.
Solution Approach 2:
The patent introduces an electron-donating compound as a mediator that prevents the direct interaction between azole compounds and copper ions that would lead to precipitate formation. This intermediary maintains etching precision while preventing harmful byproduct generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etchant effectively prevents the generation of insoluble precipitates during the etching process, ensuring a suitable etching rate and reducing defects, thereby improving the manufacturing efficiency and productivity of display devices.
Implementation Method 1
from about 0.1 to about 5 wt % of an electron-donating compound... by inhibiting nucleophilic reactions through the inclusion of electron-donating compounds
Implementation Method 2
from about 0.5 to about 20 wt % of a persulfate... The etchant effectively prevents the generation of insoluble precipitates during the etching process
Implementation Method 3
from about 0.01 to about 2 wt % of a fluorine compound... ensuring a suitable etching rate and reducing defects
Data Source
AI summary
An etchant includes, based on a total amount of the etchant, from about 0.5 to about 20 wt % of a persulfate, from about 0.01 to about 2 wt % of a fluorine compound, from about 1 to about 10 wt % of an inorganic acid, from about 0.5 to about 5 wt % of an azole compound, from about 0.1 to about 5 wt % of an electron-donating compound, from about 0.1 to about 5 wt % of a chlorine compound, from about 0.05 to about 3 wt % of a copper salt, from about 0.1 to about 10 wt % of an organic acid or an organic acid salt, and a remaining amount of water.