Chemically Etched Chuck Zone for Wafer Support
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Solution Overview
Problem
Existing chucks are complex, prone to material compatibility issues, and inefficient in supporting both conductive and non-conductive objects, particularly diced wafers, and lack adaptability for reusing components across different objects.
Innovation Solution
A chuck design featuring a supporting element with a chemically etched zone and an un-etched zone, where the un-etched zone is shaped to match the object and includes pressurized gas conduits to minimize gas leakage, combined with a closing element to further reduce gas leakage, allowing for efficient support of various objects using commonly available materials and manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a very flat upper surface is used to support diced wafers, then the wafer can be supported, but the tape tends to stick to the surface causing handling problems
Solution Approach 1:
The upper surface is divided into two distinct zones: a chemically etched zone with a textured surface and an un-etched zone with a very flat surface. The chemically etched zone provides a non-stick surface for tape release, while the un-etched zone maintains very high flatness (less than 0.5 micrometers) for precise wafer support and alignment. This local differentiation resolves the contradiction between flatness and tape sticking.
2Reliability
If pressurized gas is supplied to support the object, then the object can be held securely, but gas leakage occurs from the un-etched zone and lower surface
Solution Approach 1:
The closing element is designed with localized sealing features: a first sealing portion that seals against the un-etched zone to prevent gas leakage from the top, and a second sealing portion that seals against the lower surface to prevent gas leakage from the bottom. This localized sealing approach maintains secure object holding while minimizing gas leakage losses.
3Manufacturing precision
If a complex manufacturing process is used, then the chuck can be made with precise features, but the device complexity increases and cost rises
Solution Approach 1:
The chemically etched zone and the very flat un-etched zone are integrated into a single supporting element structure, eliminating the need for separate components. The chemical etching process creates the textured surface in-situ on the supporting element, avoiding the need for additional tapes or coatings. This merging reduces device complexity while maintaining manufacturing precision.
Solution Approach 2:
The chemical etching process changes the surface parameters of the supporting element by removing material to create a textured pattern. This parameter change (from flat to textured surface) is achieved through a controlled chemical process rather than mechanical machining, simplifying the manufacturing process while achieving the desired surface characteristics for non-stick properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, cost-effective, and adaptable chuck that efficiently supports multiple types of objects, including conductive and non-conductive materials, with reduced gas leakage and improved manufacturability, enabling effective reuse of components.
Implementation Method 1
At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches
Implementation Method 2
The un-etched zone reduces pressurized gas leakage from the un-etched zone
Implementation Method 3
the closing element reduces pressurized gas leakage from a lower surface of the supporting element
Data Source
AI summary
There is provided a chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.