Etched Groove Support Backplane for Flexible Display Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
OLED flexible modules face film pressing marks during assembly due to their lightness and thinness, leading to uneven surfaces and quality issues in flexible folding, sliding, and rolling applications, particularly in automotive displays.
Innovation Solution
A display module with a support backplane featuring etched grooves on its periphery to act as a buffer structure, dispersing stress and reducing film pressing marks, combined with a buffer connection member with a gear-shaped buffer bracket for enhanced stress distribution and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the display panel is made thin and lightweight to achieve flexibility, then the flexible display function is improved, but film pressing marks occur during assembly
Solution Approach 1:
The patent introduces a buffer structure in the form of a groove at the periphery of the through hole in the support backplane. This groove acts as a cushioning element that absorbs and disperses stress before it can reach the thin display panel and cause film pressing marks. The groove is positioned to intercept stress during assembly, preventing it from transmitting to the flexible display panel.
Solution Approach 2:
The support backplane with the groove acts as an intermediary element between the assembly process and the thin display panel. The groove in the support backplane serves as a stress-dispersing mediator that protects the fragile thin panel from direct stress concentration during assembly operations.
2Device complexity
If the support backplane structure is simplified, then the device complexity is reduced, but stress concentration causes film pressing marks
Solution Approach 1:
The support backplane is segmented into different functional regions: a first region containing the through hole for electrical connections and a second region containing the groove for stress buffering. This segmentation allows each region to perform its specific function optimally without unnecessarily complicating the overall structure.
Solution Approach 2:
The groove is locally positioned at the periphery of the through hole where stress concentration is most likely to occur. This localized stress-dispersing feature provides targeted protection without requiring complex modifications to the entire support backplane structure.
Data Source
AI summary
A display module includes a display panel and a support backplane located on a side of the display panel where a non-display surface of the display panel is located. The support backplane has a first region and a second region disposed on a periphery of the first region. At least a portion of a portion, located in the second region, of the support backplane is etched away to form at least one groove.