Etched Optical Bench With Integrated Mirror for CMOS Coupling
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Solution Overview
Problem
The challenge in designing optical transceiver modules is the complex and error-prone process of aligning the mirror device with the light path, which affects the coupling efficiency and manufacturing yield as the design scales, particularly due to the need for precise alignment of the lid portion relative to the optical bench.
Innovation Solution
An integrated mirror device is formed as a single unitary structure with the optical bench, using etching processes to align the laser diode, lens, and optical isolator along a light path, ensuring that laser light is refracted orthogonally to couple efficiently with the CMOS chip, reducing alignment errors and manufacturing complexities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a separate mirror device and lid portion are used to couple laser light to CMOS chip, then optical coupling can be achieved, but alignment complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent merges the mirror device and optical bench into a single integrated unitary structure. The mirror is formed as an integral part of the optical bench through etching processes, eliminating the need for separate mirror components and their associated alignment mechanisms. This integration directly resolves the alignment complexity issue by ensuring fixed geometric relationships between optical components.
Solution Approach 2:
The optical bench is segmented into functional sections (laser diode section, lens holder section, optical isolator section, integrated mirror section) that can be independently designed and manufactured, then assembled together. This segmentation allows for modular manufacturing while maintaining the integrated mirror structure, balancing manufacturing flexibility with alignment precision.
2Productivity
If separate components are assembled to form the optical path, then device flexibility is maintained, but manufacturing yield decreases due to alignment errors
Solution Approach 1:
The mirror and optical bench are combined into a single etched structure, eliminating multiple assembly steps and alignment operations. This integration directly improves manufacturing yield by removing the primary source of alignment errors that occur during assembly of separate components.
Solution Approach 2:
The patent replaces mechanical alignment systems with monolithic etching processes. Instead of using mechanical adjustment mechanisms or precision mechanical assemblies, the optical path is defined by etching the mirror and optical bench from a single piece of material, substituting mechanical alignment with a single-step fabrication process.
3Manufacturing precision
If integrated mirror device is used, then alignment precision improves, but manufacturing process complexity increases
Solution Approach 1:
The patent replaces complex mechanical alignment systems with monolithic etching processes. The integrated mirror device is fabricated using standard semiconductor etching techniques applied to a single piece of material, eliminating the need for precision mechanical assembly while maintaining high alignment precision through the etching process itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated mirror device within the optical bench simplifies the alignment process, enhances coupling efficiency, and increases manufacturing yield by ensuring a substantial portion of laser light is refracted and directed correctly into the CMOS chip, improving the overall performance and reliability of optical transceivers.
Implementation Method 1
The mirror device includes an angled surface for refracting incident laser light along a second light path that is substantially orthogonal relative to the first light path
Data Source
AI summary
A light engine is disclosed that includes an optical bench with a mirror etched therefrom to form a single, unitary structure. The integrated mirror may therefore be pre-aligned with an associated light path to reduce light path alignment errors. In an embodiment, the optical bench includes a first end extending to a second end along a longitudinal axis, a laser diode disposed on a mounting surface adjacent the first end of the optical bench and configured to output laser light along a first light path that extends substantially along the longitudinal axis, and an integrated mirror device disposed along the light path to receive and direct the laser light along a second light path to optically couple the laser light to a photonically-enabled complementary metal-oxide semiconductor (CMOS) die, the second light path being substantially orthogonal relative to the first light path.