Optoelectronic Semiconductor Facets via Etching for Low-Roughness Surfaces
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Solution Overview
Problem
Existing methods for manufacturing optoelectronic semiconductor devices, such as scribing and breaking, result in high fault rates due to incomplete facet separation, limit device length, and restrict design freedom due to the need for breakable substrates.
Innovation Solution
The use of an etching process to produce the coupling-out and rear surfaces of the semiconductor body, allowing for the creation of plane-parallel, low-roughness facets in a wafer composite, thereby improving manufacturing efficiency and device reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If scribing and breaking process is used to produce coupling-out surface and rear surface, then manufacturing process is simple, but surface quality is poor and fault rate is high
Solution Approach 1:
The patent replaces the mechanical scribing and breaking process with a chemical etching process to produce the coupling-out surface and rear surface. This substitution eliminates the mechanical stress and incomplete separation issues inherent in breaking processes, achieving plane-parallel surfaces with low roughness and high manufacturing precision while maintaining process simplicity.
Solution Approach 2:
The patent changes the fundamental parameter of the surface production method from mechanical (scribing and breaking) to chemical (etching). This parameter change enables precise control over surface geometry and quality, producing plane-parallel facets with controlled roughness values, thereby resolving the contradiction between manufacturing simplicity and surface quality.
2Ease of manufacture
If scribing and breaking process is used, then manufacturing process is straightforward, but device length is limited
Solution Approach 1:
By replacing the mechanical breaking process with chemical etching, the patent removes the constraint on device length. The etching process can accommodate various lengths without the mechanical stress limitations and incomplete separation issues that plague breaking processes, especially for shorter devices where breaking becomes increasingly difficult to control.
3Ease of manufacture
If scribing and breaking process is used, then initial manufacturing is simple, but design freedom is restricted due to breakable substrate requirement
Solution Approach 1:
The patent replaces the mechanical breaking process with chemical etching, which eliminates the requirement for breakable substrates. This substitution grants complete design freedom in substrate selection, allowing the use of any suitable substrate material regardless of its mechanical properties, thereby significantly enhancing adaptability and versatility while maintaining manufacturing simplicity.
4Manufacturing precision
If etching process is used to produce coupling-out surface and rear surface, then surface quality is improved, but manufacturing complexity increases
Solution Approach 1:
While the etching process is chemically more complex than mechanical breaking, it eliminates the need for multiple post-processing steps to correct breaking defects. The single-step etching process that produces plane-parallel surfaces with controlled roughness actually simplifies the overall manufacturing workflow compared to the multi-step mechanical process with its high fault rates and rework requirements.
5Reliability
If etching process is used, then fault rate is reduced, but process time may increase
Solution Approach 1:
The patent replaces the mechanical breaking process with chemical etching, which although potentially longer in duration, eliminates the high fault rates associated with incomplete separation and surface defects. The reduction in rework and scrap recovery time more than compensates for the extended etching process time, resulting in net time savings and improved overall manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etching process enables the production of optoelectronic semiconductor devices with improved surface quality, reduced fault rates, and increased design flexibility, while allowing for the manufacture of shorter devices with advantageous low gain characteristics.
Implementation Method 1
both the coupling-out surface and the rear surface of the semiconductor body are produced by means of an etching process
Data Source
AI summary
An optoelectronic semiconductor device and a method for manufacturing an optoelectronic semiconductor device are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor body having a first region of a first conductive type, an active region configured to generate electromagnetic radiation, a second region of a second conductive type and a coupling-out surface configured to couple-out the electromagnetic radiation, wherein the first region, the active region and the second region are arranged along a stacking direction, wherein the active region extends from a rear surface opposite the coupling-out surface to the coupling-out surface along a longitudinal direction transverse to or perpendicular to the stacking direction, and wherein the coupling-out surface is arranged plane-parallel to the rear surface.