Etched Adhesive Tape Interface for Battery Cell Heat Dissipation

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Solution Overview

Problem

Existing adhesive tapes in battery modules of motor vehicles do not effectively enhance thermal conductivity and heat dissipation between energy storage cells and carrier elements, limiting the efficiency and safety of heat management.

Innovation Solution

The film carrier of the adhesive tape is etched on its free surface, treated with chemicals like trichloroacetic acid, and bonded to the carrier element, with an adhesive layer applied to one or both sides, and optionally interposed with a thermally conductive mass to improve thermal contact and conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a standard adhesive tape is used between the energy storage cell and the carrier element, then the assembly is simple and成本低, but the thermal conductivity is insufficient (below 1 W/mK) and heat dissipation is inadequate

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidadhesive tape structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The adhesive tape is constructed as a composite material system consisting of a polymer film carrier (such as PET, PA, or PVC) combined with a thermally conductive adhesive layer containing filler particles (aluminum oxide, aluminum nitride, boron nitride, or graphite). This composite structure achieves thermal conductivity of 5 to 10 W/mK while maintaining the functional requirements of bonding and thermal transfer, resolving the contradiction between simple structure and effective heat dissipation.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention changes the thermal conductivity parameter of the adhesive tape from below 1 W/mK (standard adhesive) to 5-10 W/mK (etched adhesive tape with conductive filler). This parameter transformation is achieved through chemical etching of the film carrier surface and incorporation of thermally conductive fillers in the adhesive layer, thereby significantly improving heat dissipation efficiency without substantially increasing structural complexity.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the film carrier surface is etched and treated with chemicals, then thermal conductivity increases to 5-10 W/mK, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvethermal conductivityVSAvoidmanufacturing process simplicity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The film carrier surface is pre-treated with chemical etching (using agents such as trichloroacetic acid, nitric acid, or sulfuric acid) before the adhesive layer is applied. This preliminary surface modification creates a roughened morphology that enhances thermal contact and adhesion, enabling the subsequent adhesive layer to achieve optimal thermal conductivity of 5-10 W/mK. The etching process is performed as a separate preparatory step, allowing for controlled optimization of thermal properties.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If a thermally conductive mass is interposed between the adhesive tape and the carrier element, then thermal contact is improved, but the device structure becomes more complex

Engineering Contradiction:
Improvethermal contact qualityVSAvoidassembly structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A thermally conductive mass (such as thermal paste or conductive gel) is introduced as an intermediary substance between the etched adhesive tape and the carrier element surface. This intermediary fills micro-gaps and irregularities at the interface, ensuring optimal thermal contact and maximizing heat transfer efficiency. The conductive mass works synergistically with the etched adhesive tape to achieve reliable thermal coupling, justifying the slight increase in structural complexity through significant improvement in thermal contact quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The etched adhesive tape achieves thermal conductivities of 5 to 10 W/mK, effectively transferring heat from the energy storage cells to the carrier element, enhancing heat dissipation and safety.

Implementation Method 1

the adhesive tape ensures thermal contact between the unit and a carrier element for holding and cooling the unit

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The etched adhesive tape achieves thermal conductivities of 5 to 10 W/mK, effectively transferring heat from the energy storage cells to the carrier element

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 3

the free surface of the film carrier in question can be chemically treated, for example and advantageously. Such chemical treatment is recommended using acetic acid, in particular trichloroacetic acid

Methodology Applied
Scientific EffectChemical treatment:

Data Source

PatentEP4618251A1Combination of a heat-generating unit and an adhesive tape in a motor vehicle for the purpose of dissipating heat
Publication Date: 2025.09.17 CERTOPLAST TECHNISCHE KLEBEBAENDER GMBH
  • EP4618251A1 patent drawingFigure 1~2
  • EP4618251A1 patent drawing
  • EP4618251A1 patent drawing

AI summary

The invention relates to a combination of a heat-generating unit (1), for example an energy storage cell (1) of a battery module, and an adhesive tape (2) in a motor vehicle for the purpose of heat dissipation, wherein the adhesive tape (2) is equipped with a film carrier (2a) and at least one adhesive layer (2b) on one side of the film carrier (2a), and wherein the adhesive tape (2) ensures thermal contact between the unit (1) and a carrier element (3) for holding and cooling the unit (1), characterized in that the film carrier (2a) is adhesively bonded to the unit (1) on the adhesive side and is in thermal contact with the carrier element (3) on its free etched surface (2c) - optionally with the interposition of a heat-conducting mass (2d), or vice versa.