Etching Apparatus with Dynamic Bottom Drainage for Uniform Substrate Processing
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Solution Overview
Problem
Existing etching methods for liquid crystal display devices, such as deeping, spraying, and jet flowing methods, face challenges in productivity, cost, and substrate damage, particularly in efficiently etching multiple substrates simultaneously while managing reaction products and maintaining uniformity.
Innovation Solution
An etching apparatus with a receiving container, first and second spraying units, and an opening and closing driving part that supplies and drains etchant through bottom and side holes, ensuring a uniform and continuous flow to prevent impurity adherence and enhance etching efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are etched simultaneously to improve productivity, then the etching uniformity and control of etchant flow deteriorate
Solution Approach 1:
The receiving container is divided into multiple etching regions with individual substrate holders, allowing multiple substrates to be etched simultaneously while maintaining independent control over etchant flow distribution. The bottom plate includes multiple through-holes arranged to provide uniform etchant distribution across different etching regions.
Solution Approach 2:
The opening and closing driving part dynamically controls the bottom through-holes to adjust etchant flow rates in real-time. This dynamic control ensures uniform etchant distribution across multiple etching regions while maintaining high productivity through coordinated operation of multiple substrates.
2Manufacturing precision
If etchant is continuously supplied to maintain constant level for uniform etching, then the complexity of flow control system increases
Solution Approach 1:
The system employs periodic opening and closing of the bottom through-holes to maintain constant etchant level. The opening and closing driving part rhythmically adjusts the through-hole openings in response to etchant level changes, creating a self-regulating flow control mechanism that maintains uniform etching without complex continuous control systems.
Solution Approach 2:
The system incorporates feedback control where the opening and closing driving part monitors etchant level in the receiving container and automatically adjusts the bottom through-hole openings accordingly. This feedback mechanism maintains constant etchant level and uniform flow distribution while keeping the control system relatively simple through direct level-responsive actuation.
3Productivity
If bottom through-holes are used for etchant drainage to improve productivity, then the risk of impurity adherence to substrates increases
Solution Approach 1:
The settling tank is positioned below the receiving container to pre-collect and settle impurities from the etchant before it is drained through the bottom through-holes. This preliminary separation action prevents impurities from adhering to substrates during the etching process while maintaining high productivity through continuous etchant circulation.
Solution Approach 2:
The settling tank acts as an intermediary between the receiving container and the drainage system. It mediates the etchant flow by settling impurities before the etchant is drained through the bottom through-holes, thereby protecting substrates from impurity adherence while maintaining efficient etchant utilization and high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables high productivity and effective etching of multiple substrates by maintaining a constant etchant level, reducing manufacturing costs, and improving etching uniformity through controlled etchant flow, thereby enhancing the etching process.
Implementation Method 1
a first spraying unit which supplies the etchant into the receiving container
Implementation Method 2
a plurality of bottom through holes defined in the bottom plate and through which an etchant is drained from the receiving container
Implementation Method 3
an opening and closing driving part configured to open and close the bottom through holes in the bottom plate
Implementation Method 4
a settling tank disposed under the receiving container and in which an impurity in the etchant drained from the receiving container is settled
Implementation Method 5
a filter part which is connected with the settling tank and filters the etchant drained from the settling tank
Data Source
AI summary
An etching apparatus includes a receiving container which receives a substrate, and a first spraying unit which supplies etchant into the receiving container. The receiving container includes a bottom plate, a plurality of bottom through holes defined in the bottom plate and through which the etchant is drained from the receiving container; and a plurality of side walls extended from the bottom plate.