Integrated Etching Inspection for Pattern, Film, and Defect Analysis
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Solution Overview
Problem
Existing inspection methods for substrates after plasma etching require multiple devices, leading to reduced throughput due to the need for separate inspections of different items such as pattern dimensions, film thickness, and defects.
Innovation Solution
An integrated inspection method and system that uses a single imaging device to acquire image data from substrates after plasma etching, allowing simultaneous calculation of multiple inspection items including pattern dimensions, film thickness, and defect information, with correction mechanisms for etching conditions based on these calculations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple separate inspection devices are used to inspect different items (pattern dimensions, film thickness, defects), then comprehensive inspection coverage is achieved, but throughput is reduced due to multiple device transfers
Solution Approach 1:
The patent combines multiple inspection functions (pattern dimension measurement, film thickness measurement, and defect inspection) into a single inspection device. This allows all inspection items to be performed on one substrate without transferring to multiple devices, thereby maintaining comprehensive inspection coverage while improving throughput by eliminating transfer time and operational complexity.
Solution Approach 2:
The inspection device is designed with multi-functionality to perform diverse inspection tasks using a single device. It includes imaging units for pattern dimensions, film thickness measurement capabilities, and defect detection functions, allowing one device to replace multiple specialized devices while maintaining inspection quality.
2Measurement precision
If multiple separate inspection devices are used for different inspection items, then specialized measurement capabilities are maintained, but device complexity and operational complexity increase
Solution Approach 1:
Multiple specialized inspection functions are merged into a single integrated inspection device. The device includes imaging units, light sources, and processing systems that can perform pattern dimension measurement, film thickness measurement, and defect inspection, reducing the total number of devices from multiple to one.
Solution Approach 2:
The inspection device is designed as a universal platform capable of performing multiple inspection functions. It uses configurable imaging units and processing algorithms to adapt to different inspection requirements, maintaining specialized measurement capabilities while simplifying the overall system architecture.
3Measurement precision
If multiple separate inspection devices are used, then each device can be optimized for its specific function, but time is lost due to substrate transfer between devices
Solution Approach 1:
The patent merges multiple inspection functions into one device, eliminating the need to transfer substrates between different devices. The single device performs pattern dimension measurement, film thickness measurement, and defect inspection sequentially or simultaneously on the same substrate, saving transfer time while maintaining function-specific accuracy through specialized imaging and processing units.
Data Source
AI summary
There is provided a method of inspecting a substrate in an etching system including an imaging device, the method comprising: (A) imaging a substrate after plasma etching with the imaging device to acquire image data; and (B) calculating, based on the image data of the substrate after plasma etching, at least one selected from a group consisting of a dimension of a pattern on the substrate after plasma etching, information on a defect on the substrate after plasma etching, a thickness of a film on the substrate after plasma etching, and information on an appearance of the substrate after plasma etching.