Adhesive-Bonded Etching Module Assembly for Plasma-Exposed Joints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor etching equipment faces issues with corrosion and particle generation at coupled portions of metal and non-metal parts due to exposure to plasma, necessitating a method to prevent local plasma generation and particle formation.
Innovation Solution
Adhering parts made of different materials using a silicone- or ceramic-based adhesive with specific properties to prevent plasma and particle generation, ensuring thermal expansion compatibility and maintaining structural integrity during etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal parts and non-metal parts are coupled by coupling means such as bolts or rivets, then the parts can be assembled together, but corrosion and particle generation occur at the coupled portions due to plasma exposure
Solution Approach 1:
The patent introduces an adhesive as an intermediary substance between metal and non-metal parts. This adhesive layer prevents direct contact between dissimilar materials, eliminating galvanic corrosion, and provides a smooth, particle-free surface that resists plasma degradation while maintaining structural assembly capability.
Solution Approach 2:
The patent replaces mechanical coupling means (bolts, rivets) with chemical bonding through adhesive. This substitution eliminates the mechanical fastening system that creates stress concentration points and particle generation sources, while providing uniform stress distribution and corrosion resistance through the adhesive bond.
2Reliability
If adhesive is used to adhere metal and non-metal parts, then corrosion and particle generation are prevented, but the adhesive must withstand plasma exposure and thermal expansion differences
Solution Approach 1:
The patent selects adhesives with specific parameter ranges including plasma resistance, thermal stability, and matched thermal expansion coefficients. By carefully controlling these material parameters, the adhesive maintains its bonding properties and structural integrity under plasma exposure and thermal cycling conditions.
Solution Approach 2:
The patent employs composite material systems where the adhesive formulation combines multiple components to achieve both bonding strength and plasma resistance. The composite structure of the adhesive provides tailored properties that balance adhesion to dissimilar substrates with resistance to harsh plasma environments.
3Ease of operation
If conventional coupling methods are used, then assembly is straightforward, but local plasma generation occurs at the coupled portions
Solution Approach 1:
The adhesive acts as a mediator that eliminates the geometric discontinuities and material interfaces that serve as plasma generation sites. By providing a continuous, smooth bonding surface, the adhesive prevents charge accumulation and electric field concentration that would otherwise lead to local plasma discharge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents local plasma generation and particle formation at coupled surfaces, enhancing assembly ease and equipment maintenance by using adhesives with suitable thermal expansion and plasma resistance, thus improving the reliability and efficiency of semiconductor etching processes.
Implementation Method 1
determining a property of an adhesive for adhering contacting surfaces of two selected parts
Implementation Method 2
a thermal expansion coefficient of the adhesive is smaller than that of at least one of two different kinds of parts
Data Source
AI summary
A method for making a module of different kinds of parts comprises steps of: selecting two kinds of parts for performing a semi-conductor etching process; determining a property of an adhesive for adhering contacting surfaces of two selected parts; determining shapes of parts based on adhering surfaces; and adhering two kinds of parts the shapes of which are determined.