Etching Apparatus Pressure Control for Bellows Protection
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Solution Overview
Problem
The existing etching apparatuses face challenges in preventing damage to the bellows of an etchant pump due to pressure and temperature differences, leading to deformation and friction, and also struggle with efficient natural drainage of the etchant from the etching chamber to the supply part, causing corrosion and process interruptions.
Innovation Solution
The etching apparatus incorporates a first pressure adjusting unit for the etchant pump, a second pressure adjusting unit for the etching chamber and etchant supply part, a back pressure adjusting unit, and a control unit to manage pressures and gas flow, ensuring the bellows are protected and etchant is naturally drained through gravity-assisted drainage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the etching part is pressurized to prevent etchant vaporization, then etchant concentration control is improved, but the bellows in the etchant pump deforms and contacts the inner wall causing friction damage
Solution Approach 1:
The pressure control system is segmented into two independent parts: a first pressure control unit for the etchant pump and a second pressure control unit for the etching chamber and etchant supply part. This allows the pump to operate at lower pressure (reducing bellows stress) while the etching chamber maintains higher pressure (preventing vaporization).
Solution Approach 2:
The patent changes the pressure parameter differently in different parts of the system. The etchant pump operates at a first pressure level that protects the bellows, while the etching chamber operates at a second, higher pressure level that prevents etchant vaporization. This differential pressure control resolves the contradiction between protecting the pump and controlling the etching environment.
2Object-affected harmful factors
If the etching chamber and etchant supply part are pressurized to the same pressure, then bellows damage is reduced, but natural drainage of etchant becomes difficult
Solution Approach 1:
The pressure control is segmented such that the etching chamber and etchant supply part are controlled by the second pressure control unit to maintain equal pressure, preventing bellows damage during operation while allowing gravity-driven drainage when pressurization stops.
3Reliability
If the etching chamber is immersed in etchant due to poor drainage, then the etching part is broken, but preventing immersion requires additional drainage mechanisms
Solution Approach 1:
The etchant drainage system utilizes gravity as a natural force to drain etchant from the etching chamber to the etchant supply part when the pressurization is stopped or reduced. This self-service drainage mechanism prevents chamber immersion and potential damage without requiring additional active drainage components, maintaining system simplicity while ensuring reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents bellows damage by maintaining balanced pressures and facilitates smooth, gravity-driven etchant drainage, even in a pressurized state, enhancing the apparatus's performance and longevity.
Implementation Method 1
a first pressure adjusting unit which injects a gas into the etchant pump to apply a first pressure
Implementation Method 2
a second pressure adjusting unit which pressurizes the etching chamber and the etchant supply part at the same predetermined pressure
Implementation Method 3
a back pressure adjusting unit which adjusts a pressure of the gas discharged when the etchant pump operates
Implementation Method 4
a valve which controls an order and a direction in which the gas is injected into or discharged from the etchant pump
Implementation Method 5
facilitates smooth, gravity-driven etchant drainage
Data Source
AI summary
The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a first pressure adjusting unit which injects a gas into the etchant pump to apply an operation pressure, a second pressure adjusting unit which pressurizes the etching chamber and the etchant supply part at the same predetermined pressure, a back pressure adjusting unit which adjusts a pressure of the gas discharged when the etchant pump operates, and a valve which controls an order and a direction in which the gas is injected into or discharged from the etchant pump.