Etching Quality Prediction From Transfer-Path Substrate Images

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current etching processing systems face challenges in controlling the feedback of etching quality inspection results to subsequent substrate processing due to the time required for external inspection devices to obtain etching quality results.

Innovation Solution

An etching processing system that includes a memory and a processor configured to predict etching quality by inputting image data of substrates into a trained model, associating image data with etching quality information, allowing for real-time prediction of etching quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If external inspection devices are used to inspect etching quality, then measurement precision is improved, but loss of time increases

Engineering Contradiction:
Improveetching quality inspection accuracyVSAvoidtime to obtain inspection result
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The imaging device captures images of the substrate during the transfer path before external inspection, and the trained model predicts etching quality in advance. This preliminary action allows the system to obtain etching quality results before the substrate completes the full processing cycle, reducing the time loss while maintaining measurement precision through the trained prediction model.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

A trained prediction model serves as an intermediary between the imaging device and external inspection devices. The model processes images captured during transfer and provides predicted etching quality results, acting as a mediator that delivers accurate measurements without requiring the time-consuming external inspection process for every substrate.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If external inspection devices are used to obtain etching quality results, then manufacturing precision is improved, but productivity decreases

Engineering Contradiction:
Improveetching quality controlVSAvoidprocessing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The system performs preliminary etching quality prediction using the trained model during the substrate transfer path, before external inspection. This allows manufacturing precision to be maintained through accurate prediction while increasing productivity by eliminating the need to wait for external inspection results before proceeding with subsequent processing of the next substrate.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The trained model provides real-time etching quality prediction feedback during the transfer path, enabling immediate adjustment of processing parameters for subsequent substrates. This feedback mechanism maintains manufacturing precision while improving productivity by allowing continuous processing without waiting for external inspection results.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS12541837B2Etching processing system, method of predicting etching quality, and non-transitory storage medium of etching quality prediction storing a program causing a computer to implement a prediction
Publication Date: 2026.02.03 TOKYO ELECTRON LTD
  • US12541837B2 patent drawing
  • US12541837B2 patent drawing
  • US12541837B2 patent drawing

AI summary

An etching processing system includes a memory, and a processor coupled to the memory and configured to predict etching quality of a substrate by inputting image data of the substrate into a trained model trained by using training data in which image data of substrates captured by an imaging device arranged on a transfer path of the substrates and information for predicting etching quality of the substrates are associated with each other.