Etching Solution Collection and Exhaust Segmentation
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Solution Overview
Problem
Conventional semiconductor etching processes waste expensive etching solutions due to mixing and reuse issues, and generate pollutant gases that react and cause process errors, especially when using different etching solutions.
Innovation Solution
An apparatus with a substrate supporting member, treatment liquid supplying member, treatment liquid collecting member, and exhaust member that separates and collects etching solutions, prevents gas reactions by using multiple treatment liquid collecting vessels and exhaust passages, allowing for the reuse of etching solutions and reducing process errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single vessel with a drain tube is used for etching, then the device structure is simple, but the discharged etching solution mixes with remaining solution and cannot be reused, causing waste of expensive etching solutions
Solution Approach 1:
The single vessel is divided into multiple separate collecting vessels (first collecting vessel, second collecting vessel, etc.), each equipped with its own drain tube. This segmentation allows different etching solutions to be collected separately, preventing mixing and enabling reuse of expensive etching solutions while maintaining a relatively simple overall device structure.
2Loss of substance
If different etching devices are used for different etching solutions, then etching solution mixing is prevented, but it takes much more time to carry the wafer from one device to another and semiconductor process equipment becomes larger
Solution Approach 1:
Multiple collecting vessels for different etching solutions are integrated into a single etching device. The device includes a supporting member that can be positioned over different collecting vessels, allowing multiple etching processes to be performed sequentially in one device without transferring the wafer between separate devices, thus improving productivity while preventing solution mixing.
3Device complexity
If pollutant gases are discharged through the same passage and exhaust tube, then the exhaust system is simple, but the fumes react with each other causing undesired layer deposition on the passage and exhaust tube, increasing process errors
Solution Approach 1:
The exhaust system is segmented into multiple separate exhaust passages (first exhaust passage, second exhaust passage, etc.), each corresponding to different collecting vessels. Pollutant gases from different etching processes are discharged through separate passages, preventing harmful reactions between acid and basic fumes that would cause deposition and process errors, while maintaining a relatively simple exhaust system structure.
Data Source
AI summary
There is provided an apparatus for treating a substrate using a plurality of treatment solutions in sequence. The apparatus includes treatment liquid collecting vessels for separately collecting used treatment solutions, and an exhaust member for separately discharging pollutant gases generated during a process.