Etching Solution for Reflective Electrode Edge Quality
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Solution Overview
Problem
Existing methods for manufacturing reflective electrodes in display panels often result in damaged silver layers and silver particle formation at the edges, leading to decreased reflection effects and display quality.
Innovation Solution
A one-step etching process using an etching solution composed of 1 to 3 wt % nitric acid, 30 to 50 wt % acetic acid, and 30 to 50 wt % phosphoric acid is employed to etch a conductive layer stack containing molybdenum, indium-containing oxide, and silver or silver alloy, effectively suppressing edge damage and silver particle formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching methods are used to form reflective electrodes, then the etching process can be completed, but edge damage and silver particle formation occur leading to decreased reflection effect and display quality
Solution Approach 1:
The patent applies parameter changes by modifying the etching solution composition (specific ratios of nitric acid, acetic acid, and phosphoric acid) and etching process parameters (temperature, time) to achieve selective etching that prevents silver layer damage while maintaining pattern definition, thereby resolving the contradiction between manufacturing precision and reliability
Solution Approach 2:
The patent uses an intermediary approach by introducing a specifically formulated etching solution that acts as a mediator between the photoresist pattern and the conductive layer stack. This intermediary solution enables controlled removal of unwanted material while protecting the silver layer from damage, preventing both edge damage and silver particle formation
2Manufacturing precision
If multi-step etching process is used to etch different layers, then selective etching can be achieved, but process complexity increases and productivity decreases
Solution Approach 1:
The patent merges multiple etching steps into a single etching process by using a specially formulated etching solution that can selectively etch different layers (ITO, Mo, Ag) simultaneously through one-step processing. This combining approach maintains selective etching precision while significantly improving productivity by reducing process steps
Solution Approach 2:
The etching solution exhibits multi-functionality by being capable of etching multiple different materials (transparent conductive oxide, molybdenum, silver) with a single formulation. This universal etching solution performs the function of multiple separate etchants, achieving both selective precision and process efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reflection effect and display quality by preventing edge damage and silver particle formation, enhancing the yield and image clarity of reflective electrodes.
Implementation Method 1
performing an etching process on the conductive layer stack to form a first patterned sub-layer, a second patterned sub-layer, and a third patterned sub-layer. The etching solution includes 1 to 3 wt % of nitric acid, 30 to 50 wt % of acetic acid, 30 to 50 wt % of phosphoric acid
Data Source
AI summary
This invention discloses an etching solution and a manufacturing method of a display panel. The method includes following steps: providing a substrate; forming a conductive layer stack including a first sub-layer, a second sub-layer and a third sub-layer on the substrate, the first sub-layer includes molybdenum, the second sub-layer is disposed on the first sub-layer and includes a transparent conductive material including indium-containing oxide, the third sub-layer is disposed between the first sub-layer and the second sub-layer and includes silver or silver alloy; performing an etching process, the first sub-layer, the second sub-layer and the third sub-layer are etched by an etching solution to form a first patterned sub-layer, a second patterned sub-layer and a third patterned sub-layer. The etching solution includes 1 to 3 wt % of nitric acid, 30 to 50 wt % of acetic acid, 30 to 50 wt % of phosphoric acid and a remaining amount of water.