Etching Workbench Dual-Loop Temperature Control for Uniform Substrates
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Solution Overview
Problem
Existing etching workbenches face challenges with uneven temperature distribution due to temperature control fluid absorbing heat as it flows, leading to substrate deformation and reduced etching quality, with current solutions either being costly or ineffective in quickly adjusting to temperature changes.
Innovation Solution
A temperature control method and system that acquires real-time temperatures of the workbench and fluid, using a dual-loop feedback control to stabilize the workbench temperature within a preset range by adjusting the temperature control fluid loop, incorporating a controller and evaporator to quickly respond to temperature fluctuations and reduce heat accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the temperature control fluid continuously flows through the etching workbench to regulate temperature, then the workbench temperature can be controlled, but the fluid absorbs heat during flow causing temperature difference between input and output terminals, resulting in uneven temperature distribution and substrate deformation
Solution Approach 1:
The temperature control system is divided into two independent loops: a workbench temperature control fluid loop and a temperature adjustment loop. The workbench loop includes pipes for circulating temperature control fluid through the etching workbench, while the temperature adjustment loop includes an evaporator and condenser for rapid temperature adjustment. This segmentation allows independent optimization of each loop's function.
Solution Approach 2:
The temperature adjustment loop acts as an intermediary system that can rapidly adjust the temperature of the temperature control fluid before it enters the workbench loop. The evaporator and condenser in the temperature adjustment loop serve as mediator components that facilitate quick thermal response, preventing the fluid from absorbing excessive heat during circulation through the workbench.
2Device complexity
If conventional temperature control methods are used, then the system structure is simple, but the response speed to temperature changes is slow and cannot quickly adjust to temperature fluctuations
Solution Approach 1:
The temperature adjustment loop is designed with dynamic components including an evaporator and condenser that can rapidly respond to temperature changes. The system transitions from static temperature control to dynamic adjustment, allowing the temperature control fluid to be quickly heated or cooled based on real-time temperature feedback from the workbench.
Solution Approach 2:
The evaporator and condenser in the temperature adjustment loop utilize phase transitions of the temperature control fluid (liquid to gas in evaporator, gas to liquid in condenser) to achieve rapid heat absorption and release. This phase change mechanism enables the system to respond quickly to temperature fluctuations without requiring complex mechanical adjustments.
3Reliability
If the temperature control fluid loop is designed for stable circulation, then the system operates reliably, but the temperature distribution becomes uneven due to continuous heat absorption during flow
Solution Approach 1:
The system incorporates temperature sensors that continuously monitor the temperature of the etching workbench and the temperature control fluid. This feedback information is used by the control system to adjust the operation of the evaporator and condenser in the temperature adjustment loop, ensuring that the fluid maintains an appropriate temperature before entering the workbench loop, thus preventing uneven temperature distribution while maintaining stable circulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the response speed of temperature control, reduces temperature overshoot, and achieves a regularized temperature distribution on the substrate, improving etching quality by allowing for controllable substrate deformation and reducing the need for extensive product testing.
Implementation Method 1
the controller is configured to control the temperature adjustment loop to adjust a real-time temperature of a temperature control fluid in the workbench temperature control fluid loop by the evaporator
Data Source
AI summary
The present application provides a temperature control method, an apparatus, an electronic device and a storage medium for an etching workbench. A real-time temperature of an etching workbench and a real-time temperature of a temperature control fluid are acquired firstly; then, a temperature control instruction is determined according to the real-time temperature of the etching workbench, the real-time temperature of the temperature control fluid and a limit temperature; and finally, in response to the temperature control instruction, a target operating temperature of the etching workbench is stabilized within a preset range by a circulating temperature control fluid loop.