Ether-Shell Hollow Resin Particles for Low-Loss PCB Insulation
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Solution Overview
Problem
Existing hollow resin particles used in electronic devices have insufficient heat resistance and high dielectric constants, dielectric loss tangents, and water absorption, making them unsuitable for reducing dielectricity and dielectric loss tangent in insulating layers of multilayer printed boards.
Innovation Solution
A hollow resin particle with a shell portion and a hollow portion, where the shell has an ether structure, is developed, achieving a 5% thermal weight loss temperature of 300°C or higher and a low water absorption ratio, allowing for reduced dielectricity and dielectric loss tangent, and is produced through a simple method involving a compound with an ether structure and a monomer in an aqueous medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If acrylic hollow resin particles are used, then the production process is simple, but the heat resistance is insufficient and water absorption ratio is high
Solution Approach 1:
The patent uses styrene-based monomers combined with divinylbenzene as crosslinking agents to create composite hollow resin particles. This composite approach provides both the desired heat resistance and low water absorption while maintaining a relatively simple suspension polymerization process. The crosslinked network structure achieved through this composite approach ensures thermal stability without significantly complicating manufacturing.
2Quantity of substance
If styrene-based hollow resin particles with saturated hydrocarbon solvent are used, then dielectric constant is reduced, but the solvent cannot be completely removed and production cost increases
Solution Approach 1:
The patent extracts the problematic saturated hydrocarbon solvent (hexadecane) from the system and replaces it with aromatic hydrocarbon solvents like toluene or xylene. These alternative solvents can be more easily removed through distillation due to their lower boiling points, eliminating the need for complex solvent removal processes while maintaining the low dielectric constant property. This extraction approach reduces production cost and simplifies the manufacturing process.
3Reliability
If hollow resin particles with crosslinked shell are used, then heat resistance is improved, but the production process becomes more complex
Solution Approach 1:
The patent achieves heat resistance by controlling the degree of crosslinking through parameter optimization. By adjusting the amount of divinylbenzene (0.1-10 wt% based on total monomer weight) and the polymerization conditions, the patent creates a crosslinked network structure that provides sufficient heat resistance without requiring overly complex multi-step processes. The crosslinking is achieved in a single suspension polymerization step, maintaining process simplicity while ensuring thermal stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hollow resin particle effectively reduces dielectricity and dielectric loss tangent while exhibiting excellent heat resistance and low water absorption, making it suitable for semiconductor components, paint compositions, and heat-insulating applications.
Implementation Method 1
achieve reductions in dielectricity and dielectric loss tangent
Implementation Method 2
exhibiting excellent heat resistance and having a 5% thermal weight loss temperature of 300°C or higher
Implementation Method 3
having a low water absorption ratio
Data Source
AI summary
Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).