Ethynyl Composite Resist Underlayer Coating for Heat-Stable Planarization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, existing compositions for resist underlayer coatings face challenges with heat resistance, weight loss, and film thickness shrinkage during high-temperature processing, particularly on substrates with uneven dense and sparse regions, leading to difficulties in achieving planarization.
Innovation Solution
An ethynyl derived composite comprising specific aromatic units A and B, which forms a composition that can be cured to create a resist underlayer coating with improved heat resistance, reduced weight loss, and enhanced planarization capabilities, even on substrates with complex structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional compositions are used for resist underlayer coatings, then coating can be formed on substrate, but heat resistance is insufficient and weight loss occurs during high-temperature processing
Solution Approach 1:
The patent modifies the chemical structure of the coating composition by introducing ethynyl groups (C≡C) into the polymer backbone, creating a triple-bond-containing composite structure that exhibits superior thermal stability and resistance to weight loss during high-temperature processing compared to conventional compositions
Solution Approach 2:
The invention uses a composite material system consisting of ethynyl-containing polymer units combined with specific aromatic structures (units A and B) to create a coating composition that achieves both heat resistance and minimal weight loss, overcoming the limitations of single-material systems
2Manufacturing precision
If conventional compositions are used for coating on non-flat substrates, then coating can be applied, but planarization is poor due to surface tension and contraction
Solution Approach 1:
The patent changes the physical and chemical parameters of the coating composition by incorporating ethynyl groups and specific aromatic structures that reduce surface tension and minimize contraction during curing, enabling effective planarization on non-flat substrates while maintaining compositional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ethynyl derived composite coatings exhibit excellent heat resistance, minimal weight loss, and effective planarization, allowing for successful filling of gaps and maintaining film thickness, even on non-flat substrates.
Implementation Method 1
Resist compositions and other layer compositions can be coated on such substrates as liquid state, and can be cured by irradiation, heating and so on to obtain resist coating and other coatings
Implementation Method 2
Resist compositions and other layer compositions can be coated on such substrates as liquid state, and can be cured by irradiation, heating and so on to obtain resist coating and other coatings
Implementation Method 3
specific compounds having carbon-carbon triple bond for resist underlayer compositions were studied, which could be used with PGMEA and so on as solvent, could be good at solvent disabilities, etching resistances, heat resistances and gap filling
Implementation Method 4
it is difficult for a coating formed from a composition on the substrate to be planarized, since there occur interactions among components of the composition, because of surface tension and/or contraction during conversion to the coating
Data Source
AI summary
[Problem to be Solved] An object is to provide a compound with good heat resistance. And another object is to provide a coating made exhibits less film shrinkage, good gap filling property and good planarization. [Solution] The present invention provides an ethynyl derived composite and a composition comprising thereof. And the present invention provides a method for manufacturing a coating by it, and a method for manufacturing a device.