Eutectic-Bonded Heat Exchange Module for Metal-Ceramic Substrates
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Solution Overview
Problem
Conventional heat exchange systems using metal-ceramic substrates with glues, sinter pastes, or solder are cumbersome and limited by massive thermal mass, making customization and manufacturing difficult.
Innovation Solution
A heat exchange compound module with a metal-ceramic substrate and a heat exchange structure connected via an eutectic bond, eliminating the need for adhesives and allowing for integrated, customizable, and cost-effective manufacturing by forming a direct thermal connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glues, sinter pastes, solder or thermal interface materials are used to attach the metal-ceramic substrate to the heat sink, then the attachment process becomes cumbersome and complex, but the thermal connection is achieved
Solution Approach 1:
The invention extracts and eliminates the intermediate bonding materials (glues, sinter pastes, solder, thermal interface materials) from the attachment process. By directly bonding the heat exchange structure to the metal-ceramic substrate through eutectic bonding, the patent removes the cumbersome intermediate layers while maintaining reliable thermal connection, thus resolving the contradiction between connection reliability and manufacturing complexity
Solution Approach 2:
The invention merges the heat exchange structure and the metal-ceramic substrate into a single integrated component through eutectic bonding. This direct integration eliminates the need for separate bonding materials and processes, reducing manufacturing complexity while ensuring reliable thermal connection between the components
2Use of energy by moving object
If a massive heat sink is used to provide thermal mass, then thermal energy storage is improved, but customization of position, shape and size becomes limited
Solution Approach 1:
The invention segments the heat exchange function into a separate, modular heat exchange structure that can be independently designed and optimized. This structure includes multiple heat exchange elements (such as pin fins) that can be customized in position, shape, and size according to specific application requirements, while still providing effective thermal management without relying on massive thermal mass
Solution Approach 2:
The invention changes the design parameters from massive thermal mass to optimized heat exchange surface area and geometry. By adjusting parameters such as pin fin dimensions, spacing, and arrangement, the system achieves effective heat dissipation with minimal mass, enabling full customization for different power electronic modules while maintaining thermal performance
3Ease of manufacture
If conventional bonding methods with adhesives are used, then the heat exchange structure can be attached to the substrate, but manufacturing becomes more costly and less efficient
Solution Approach 1:
The invention employs self-service bonding through eutectic reaction, where the bonding process utilizes the inherent properties of the metal layers themselves. The aluminum and copper layers form a eutectic bond through direct contact and heating, eliminating the need for external adhesives or complex bonding equipment. This self-bonding mechanism simplifies the manufacturing process and significantly improves production efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies manufacturing, enhances thermal reliability, and allows for customized heat exchange solutions, particularly suitable for power electronic modules and liquid-cooled systems, while avoiding the limitations of massive thermal mass.
Implementation Method 1
The heat exchange structure is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material, wherein the first metallic material and the second metallic material form an eutectic system
Implementation Method 2
the heat exchange structure is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material
Data Source
Figure 1
Figure 2~3
AI summary
The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.