Metal-Ceramic Heat Exchange Module With Eutectic-Bonded Pin Fins

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Solution Overview

Problem

Conventional heat exchange systems using metal-ceramic substrates with glues, sinter pastes, or solder are cumbersome and limited by the massive thermal mass of heat sinks, making customization and manufacturing inefficient.

Innovation Solution

A heat exchange compound module with a metal-ceramic substrate and a heat exchange structure connected via a eutectic bond, eliminating the need for glues or solder and allowing for easier customization and integration of a pin fin cooler or heat sink directly onto the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glues, sinter pastes, or solder are used to attach the heat exchange structure to the metal-ceramic substrate, then the attachment process is established, but the manufacturing process becomes cumbersome and less reliable

Engineering Contradiction:

Improveattachment reliabilityVSAvoidmanufacturing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes intermediate attachment materials (glues, sinter pastes, solder) from the bonding process. The heat exchange structure is directly bonded to the metal-ceramic substrate through a eutectic reaction between metallic layers, eliminating cumbersome attachment processes while maintaining reliable thermal and mechanical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a metallic layer on the heat exchange structure that undergoes eutectic reaction with the metallic layer on the substrate. This creates an intermediate eutectic bonding interface that provides reliable attachment without requiring external glues or solder, simplifying manufacturing while ensuring strong thermal and mechanical bonding.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If a massive heatsink is used for heat exchange, then heat dissipation capacity is provided, but thermal mass issues arise and customization is limited

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidcustomization flexibility

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The heat exchange structure is segmented into discrete pin fins rather than a massive continuous heatsink. This segmentation reduces overall thermal mass while maintaining effective heat dissipation surface area, and allows flexible customization of position, shape, and size to adapt to different application requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent changes the physical parameters of the heat exchange structure by using thin metallic layers (5-50 micrometers) instead of massive heatsink material. This reduces thermal mass significantly while maintaining heat dissipation effectiveness through the pin fin geometry and direct thermal connection to the substrate.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If conventional attachment methods are used, then the heat exchange structure is connected to the substrate, but the thermal connection is reduced due to intermediate materials

Engineering Contradiction:

Improvethermal connection qualityVSAvoidattachment process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the attachment function and thermal conduction function into a single eutectic bonding process. The metallic layers on both the substrate and heat exchange structure undergo eutectic reaction to form a bonded joint that provides both mechanical attachment and excellent thermal connection, eliminating intermediate materials that would impede heat flow.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies manufacturing, reduces thermal mass issues, and enhances thermal connection, making the system more reliable, cost-effective, and customizable for applications like power electronic modules and liquid-cooled systems.

Implementation Method 1

The heat exchange structure is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material

Methodology Applied

Scientific EffectEutectic bond: Diffusion Welding

Implementation Method 2

there is an improved thermal connection between the metal-ceramic substrate and the heat exchange structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11828546B2Heat exchange compound module

Publication Date: 2023.11.28 HERAEUS ELECTRONICS GMBH & CO KG

AI summary

The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.